IP Library Patent Application 15307410
Patent Application
App. No. 15/307,410

THERMALLY CONDUCTIVE COMPOSITES AND METHODS OF MANUFACTURE THEREOF, AND ARTICLES CONTAINING THE COMPOSITES

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Quick Facts
Patent No.
US None
App. No.
15/307,410
Abstract

A thermally conductive composite includes a polymer; and boron nitride, wherein the boron nitride is in a form of a nanofiber, a nanotube, a nanoplate, or a combination thereof. Alternatively, a thermally conductive composite includes a boron nitride comprising pores; and a polymer disposed in a pore of the boron nitride.

Claims (28)

1 . A thermally conductive composite comprising:

a polymer; and

boron nitride, wherein the boron nitride is in a form of a nanofiber.

2 . (canceled)

3 . The thermally conductive composite of claim 1 , wherein the nanofiber is in a woven form.

4 . The thermally conductive composite of claim 1 , wherein the boron nitride nanofiber has a cross-sectional dimension of 1 to 100 nanometers.

5 . The thermally conductive composite of claim 1 , wherein the boron nitride nanofiber has a length of 100 nanometers to 10 millimeters.

6 . The thermally conductive composite of claim 1 , wherein the boron nitride nanofiber has an aspect ratio of 10 to 1,000,000.

7 . The thermally conductive composite of claim 1 , wherein the boron nitride nanofibers extends in a direction substantially perpendicular to a major surface of the polymer layer.

8 . A thermally conductive composite comprising:

a boron nitride comprising pores; and

a polymer disposed in a pore of the boron nitride.

9 . The thermally conductive composite of claim 8 , wherein the boron nitride has an average pore size of 5 to 1000 nanometers.

10 . The thermally conductive composite claim 8 , wherein the boron nitride is a doped boron nitride.

11 . The thermally conductive composite of claim 8 , wherein the composite is in the form of a layer.

12 . A method of manufacturing the thermally conductive composite of claim 1 , the method comprising:

combining a polymer or a pre-polymer composition with the boron nitride nanofibers and a solvent to form a mixture;

casting the mixture to form a layer; and

removing the solvent to manufacture the thermally conductive composite.

13 . The method of claim 12 , further comprising crosslinking the polymer.

14 . The method of claim 12 , further comprising foaming the polymer.

15 . The method of claim 12 , wherein the boron nitride is a porous boron nitride.

16 . A circuit material comprising the thermally conductive composite of claim 1 , optionally disposed on a conductive layer.

17 . A printed circuit board comprising the thermally conductive composite of claim 1 , optionally disposed on a conductive layer.

18 . A circuit material comprising the thermally conductive composite of claim 8 , optionally disposed on a conductive layer.

19 . The thermally conductive composite claim 1 , wherein the boron nitride is a doped boron nitride.

20 . The method of claim 12 , further comprising polymerizing the prepolymer composition.

21 . The method of claim 15 , further comprising polymerizing the pre-polymer composition in a pore of the porous boron nitride.

Assignments (2)
SECURITY INTEREST Recorded Feb 20, 2017
From: ROGERS CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041757/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2016
From: ZHANG, LI; SETHUMADHAVAN, MURALI
To: ROGERS CORPORATION
Reel/Frame 040213/0947 →