Solid-state imaging device, method of manufacturing the same, and electronic device
View Patent ↗The present disclosure relates to a solid-state imaging device capable of further decreasing reflectivity, a method of manufacturing the same, and an electronic device. The solid-state imaging device includes a semiconductor substrate on which a photoelectric converting unit is formed for each of a plurality of pixels, and an antireflection structure provided on a light incident surface side from which light is incident on the semiconductor substrate in which a plurality of types of projections of different heights is formed. The antireflection structure is formed by performing processing of digging a light incident surface of the semiconductor substrate in a plurality of stages with different processing conditions. The antireflection structure is the structure in which a second projection lower than a first projection is formed between the first projections of predetermined height. The present technology may be applied to a CMOS image sensor, for example.
1. A solid-state imaging device comprising:
a semiconductor substrate comprising a plurality of photoelectric converting units, wherein each of the plurality of photoelectric converting units includes a fine uneven surface comprising:
a plurality of projections formed in an antireflection structure, the antireflection structure being the structure provided on a light incident surface side of the semiconductor substrate, the plurality of projections comprising:
a first plurality of projections of a first predetermined height; and
a second plurality of projections of a second predetermined height,
wherein the second predetermined height is less than the first predetermined height, wherein each one of the first plurality of projections is separated from another one of the first plurality of projections by one of the second plurality of projections,
wherein a first side of the antireflection surface is in contact with the semiconductor substrate, and wherein a second side of the antireflection surface is in contact with a light transmitting flattening film.
2. The solid-state imaging device according to claim 1 , wherein the antireflection structure is formed by performing a process of digging a light incident surface of the semiconductor substrate in a plurality of stages with different processing conditions.
3. A method of manufacturing comprising a step of:
forming an antireflection structure, the antireflection structure being the structure provided on a light incident surface side from which light is incident on a semiconductor substrate on which a photoelectric converting unit is formed for each of a plurality of pixels wherein a first plurality of projections of a first predetermined height is formed by performing a first process of digging a light incident surface of the semiconductor substrate and a second plurality of projections of a second predetermined height is formed by performing a second process of digging the light incident surface of the semiconductor substrate, the first processing and the second process being in a plurality of stages with different process conditions,
wherein the second predetermined height is less than the first predetermined height, wherein each one of the first plurality of projections is separated from another one of the first plurality of projections by one of the second plurality of projections,
wherein a first side of the antireflection structure is in contact with the semiconductor substrate, and wherein a second side of the antireflection structure is in contact with a light transmitting flattening film.
4. An electronic device comprising:
a solid-state imaging device comprising:
a semiconductor substrate comprising a plurality of photoelectric converting units, wherein each of the plurality of photoelectric converting units includes a fine uneven surface comprising:
a plurality of projections formed in an antireflection structure, the antireflection structure being the structure provided on a light incident surface side of the semiconductor substrate, the plurality of projections comprising:
a first plurality of projections of a first predetermined height; and
a second plurality of projections of a second predetermined height,
wherein the second predetermined height is less than the first predetermined height, wherein each one of the first plurality of projections is separated from another one of the first plurality of projections by one of the second plurality of projections,
wherein a first side of the antireflection surface is in contact with the semiconductor substrate, and wherein a second side of the antireflection surface is in contact with a light transmitting flattening film.
5. The method according to claim 3 , wherein forming the antireflection structure comprises forming a mask of a pattern corresponding to a site in which the first projection is provided on the light incident surface of the semiconductor substrate.