Conductive composition, antistatic film, laminate and production therefor, and production method for photomask

1. A conductive composition, comprising:

a conductive polymer (a) having a sulfonic acid group and/or a carboxyl group;

a basic compound (b) having at least one nitrogen-containing heterocyclic ring and one amino group;

a water-soluble polymer (c) having a hydroxyl group, with the proviso that the conductive polymer (a) is excluded;

a hydrophilic organic solvent (d); and

water (e).

2. The conductive composition according to claim 1 , wherein the basic compound (b) has a conjugated structure.

3. The conductive composition according to claim 1 , wherein the nitrogen-containing heterocyclic ring is a pyridine ring.

4. The conductive composition according to claim 1 , wherein the water-soluble polymer (c) is polyvinyl alcohol.

5. The conductive composition according to claim 4 , wherein a saponification degree of the polyvinyl alcohol is 85% or more.

6. The conductive composition according to claim 1 , wherein the hydrophilic organic solvent (d) is a monohydric alcohol having from 1 to 3 carbon atoms.

7. The conductive composition according to claim 1 , wherein a content of the hydrophilic organic solvent (d) is from 1 to 15% by mass with respect to a total mass of the conductive composition.

8. The conductive composition according to claim 1 , wherein the conductive polymer (a) has a unit of formula (1):

wherein in the formula (1),

R 1 to R 4 each independently represent a hydrogen atom, a linear or branched alkyl group having from 1 to 24 carbon atoms, a linear or branched alkoxy group having from 1 to 24 carbon atoms, an acidic group, a hydroxyl group, a nitro group, or a halogen atom, and

at least one of R 1 to R 4 is an acidic group, wherein the acidic group is a sulfonic acid group or a carboxyl group.

9. An antistatic film comprising the conductive composition according to claim 1 , wherein

the antistatic film has a maximum value of absorption in a wavelength region of from 450 to 500 nm in the ultraviolet and visible absorption spectrum at from 350 to 900 nm.

10. A laminate comprising:

a substrate; and

an antistatic film formed on at least one surface of the substrate, the antistatic film comprising the conductive composition according to claim 1 , wherein

the antistatic film has a maximum value of absorption in a wavelength region of from 450 to 500 nm in the ultraviolet and visible absorption spectrum at from 350 to 900 nm.

11. The laminate according to claim 10 , further comprising a resist layer on the antistatic film.

12. The laminate according to claim 11 , further comprising a conductive layer on the resist layer.

13. The laminate according to claim 10 , wherein a surface roughness (Ra) of an outermost layer on the antistatic film side is 1.5 nm or less.

14. A method for producing a laminate, the method comprising:

forming an antistatic film by coating or impregnating the conductive composition according to claim 1 on at least one surface of a substrate; and then

subjecting the conductive composition to a heat treatment at 80° C. or higher.

15. The production method according to claim 14 , further comprising forming a resist layer on the antistatic film.

16. The production method according to claim 15 , further comprising forming a conductive layer on the resist layer.

17. A method for producing a photomask, the method comprising:

forming an antistatic film by coating or impregnating the conductive composition according to claim 1 on at least one surface of a substrate and then subjecting the conductive composition to a heat treatment at 80° C. or higher;

forming a resist layer on the antistatic film;

performing pattern drawing by irradiating a surface of the resist layer with ionizing radiation;

forming a resist pattern by developing the resist layer after pattern drawing;

etching the antistatic film by using the resist pattern as a mask; and

removing the resist pattern remaining on the substrate after etching.

18. A method for producing a photomask, the method comprising:

forming an antistatic film by coating or impregnating the conductive composition according to claim 1 on at least one surface of a substrate and then subjecting the conductive composition to a heat treatment at 80° C. or higher;

forming a resist layer on the antistatic film;

forming a conductive layer on the resist layer;

performing pattern drawing by irradiating a surface of the resist layer with ionizing radiation from a conductive layer side;

forming a resist pattern by removing the conductive layer and developing the resist layer after pattern drawing;

etching the antistatic film by using the resist pattern as a mask; and

removing the resist pattern remaining on the substrate after etching.

19. The production method according to claim 17 , wherein the substrate has a light shielding layer on a side of an interface between the substrate and the antistatic film and the etching further comprises etching the light shielding layer.