Bonding method with peripheral trench
View Patent ↗A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.
1. A method of making an integrated device having upper and lower planar components forming part of a stack and bonded together by an adhesive layer of well-defined thickness, comprising:
providing a trench within a peripheral recess formed within a marginal portion of a support frame for said stack;
applying an excess amount of adhesive to one of said planar components;
bringing said upper and lower planar components into proximity such that said adhesive layer of well-defined thickness is formed between said upper and lower planar components; and
collecting surplus adhesive in said trench.
2. The method as claimed in claim 1 , wherein the lower component is a silicon substrate.
3. The method as claimed in claim 2 , wherein the peripheral trench is linear.
4. The method as claimed in claim 2 , wherein the peripheral trench is formed on opposite sides of the support frame.
5. The method as claimed in claim 2 , wherein the support frame is made of aluminum.
6. The method as claimed in claim 5 , wherein the peripheral trench is milled into the support frame.
7. The method as claimed in claim 6 , wherein the trench is U-shaped.
8. The method as claimed in claim 6 , wherein the device is an X-ray detector.
9. The method as claimed in claim 2 , wherein the surplus adhesive remains in situ in the peripheral trench during a subsequent curing step.
10. The method as claimed in claim 1 , wherein the trench is U-shaped.
11. The method as claimed in claim 1 , wherein the device is an X-ray detector.
12. The method of claim 1 . wherein in the providing step a surface of the peripheral recess formed in the marginal portion is lower than a surface of the marginal portion, the support frame being planar and includes the peripheral recess and the marginal portion.
13. The method of claim 1 , wherein the providing step, the trench is formed within the peripheral recess, the peripheral recess and the formed trench configured along a pair of opposite sides of the support frame defining a rectangle.
14. An integrated device comprising:
a planar substrate forming part of a stack bonded onto a support frame,
an upper layer bonded onto said planar substrate by an adhesive layer of well-defined thickness, and
wherein said support frame has peripheral recess formed in a marginal portion thereof below said planar substrate and a trench within said peripheral contains surplus adhesive.
15. The integrated device as claimed in claim 14 , wherein the upper layer is an interface layer.
16. The device as claimed in claim 15 , wherein the peripheral trench is located on opposite sides of the support frame.
17. A device as claimed in claim 16 , wherein the trench is U-shaped.
18. A device as claimed in claim 15 , wherein the trench is U-shaped.
19. The device as claimed in claim 14 , wherein the peripheral trench is linear.
20. The device as claimed in claim 19 , wherein the trench is milled into the support frame.
21. The device as claimed in claim 14 , wherein the support frame is made of aluminum.
22. The device as claimed in claim 14 , wherein the trench is U-shaped.
23. The device as claimed in claim 14 , wherein the device is an X-ray detector.
24. The integrated device of claim 14 , wherein a surface of the peripheral recess formed in the marginal portion is lower than a surface of the marginal portion, the support frame being planar and includes the peripheral recess and the marginal portion.
25. The integrated device of claim 14 , wherein the trench is formed within the peripheral recess, the peripheral recess and the formed trench configured along a pair of opposite sides of the support frame defining a rectangle, the planar substrate positioned within the rectangle.