Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate

1 . A method for producing a multilayer substrate,

A) Providing a main body ( 26 ) comprising a plurality of ceramic layers ( 2 ), wherein at least one layer ( 2 ) comprises a hole ( 27 ),

B) Filling the hole ( 27 ) with a metal by depositing the metal from a solution in order to form a plated-through hole ( 4 , 18 , 20 , 21 ).

2 . The method as claimed in claim 1 , wherein the metal contains copper.

3 . The method as claimed in either of claims 1 and 2 , wherein the hole ( 27 ) leads through a plurality of ceramic layers ( 2 ).

4 . The method as claimed in any of claims 1 to 3 ,

wherein the multilayer substrate ( 1 ) comprises in the interior of the main body ( 26 ) a further contact ( 11 ) connected to the plated-through hole ( 4 , 18 , 20 , 21 ), wherein the further contact ( 11 ) differs from the plated-through hole ( 4 , 18 , 20 , 21 ) in terms of the material and/or the production method.

5 . The method as claimed in claim 4 ,

wherein the further contact ( 11 ) comprises silver, tungsten, molybdenum and/or copper.

6 . The method as claimed in either of claims 4 and 5 ,

wherein the further contact ( 11 ) comprises a fired paste.

7 . The method as claimed in any of claims 4 to 6 ,

wherein the further contact ( 11 ) comprises an inner ply ( 13 ) arranged on a ceramic layer ( 2 ) in the interior of the main body ( 26 ).

8 . The method as claimed in any of claims 4 to 7 ,

wherein the further contact ( 11 ) comprises a further plated-through hole ( 12 ) leading through at least one further ceramic layer ( 2 ).

9 . The method as claimed in any of claims 1 to 8 ,

wherein, upon depositing the metal, a connection contact ( 5 , 19 , 22 ) for connecting a component ( 23 ) is produced on an outer side ( 6 , 14 , 15 ) of the main body.

10 . A multilayer substrate, comprising a main body ( 26 ) having a plurality of ceramic layers ( 2 ), wherein at least one of the layers ( 2 ) comprises a plated-through hole ( 4 , 18 , 20 , 21 ) containing a metal introduced by deposition from a solution.

11 . A multilayer substrate, comprising a main body ( 26 ) having a plurality of ceramic layers ( 2 ), wherein the multilayer substrate comprises a plated-through hole ( 4 , 18 , 20 , 21 ) and a further contact ( 11 ) connected thereto, wherein the plated-through hole ( 4 , 18 , 20 , 21 ) leads through at least one of the layers ( 2 ), and the further contact ( 11 ) is arranged in the interior of the main body ( 26 ), and wherein the plated-through hole ( 4 , 18 , 20 , 21 ) comprises a different material than the further contact ( 11 ) and/or is produced by a different production method.

12 . The multilayer substrate as claimed in claim 11 ,

wherein the plated-through hole ( 4 , 18 , 20 , 21 ) comprises copper and the further contact comprises silver, tungsten, molybdenum and/or copper.

13 . A multilayer substrate, comprising a main body ( 26 ) having a plurality of ceramic layers ( 2 ), wherein the main body ( 26 ) is produced using HTCC technology and comprises a plated-through hole ( 4 , 18 , 20 , 21 ) leading through at least one of the layers, wherein the plated-through hole ( 4 , 18 , 20 , 21 ) contains copper.

14 . The multilayer substrate as claimed in any of claims 11 to 13 ,

wherein the further contact ( 11 ) comprises a further plated-through hole ( 18 ) in at least one ceramic layer.

15 . The multilayer substrate as claimed in any of claims 11 to 14 ,

wherein the further contact ( 11 ) comprises an inner ply ( 13 ) in the interior of the main body ( 26 ), said inner ply being arranged on a ceramic layer ( 2 ).