Methods for producing a plurality of conversion elements, conversion element and optoelectronic component
View Patent ↗A method for producing a plurality of conversion elements ( 10 ) is specified, comprising providing a carrier substrate ( 1 ), introducing a converter material ( 3 ) into a matrix material ( 2 ), applying the matrix material ( 2 ) with the converter material ( 3 ) to individual regions ( 8 ) of the carrier substrate ( 1 ) in a non-continuous pattern, applying a barrier substrate ( 5 ) to the matrix material ( 2 ) and to the carrier substrate ( 1 ), and singulating the carrier substrate ( 1 ) with the matrix material ( 2 ) and the barrier substrate ( 5 ) into a plurality of conversion elements ( 10 ) along singulation lines (V), wherein the conversion elements ( 10 ) in each case comprise at least one of the regions ( 8 ) of the matrix material ( 2 ).
1. A method for producing a plurality of conversion elements, comprising the following steps:
providing a carrier substrate;
introducing a converter material into a matrix material;
applying the matrix material with the converter material on individual regions of the carrier substrate in a non-continuous pattern, wherein the regions are formed in the carrier substrate as cavities;
applying a barrier substrate on the matrix material and on the carrier substrate; and
singulating the carrier substrate with the matrix material and the barrier substrate into a plurality of conversion elements along singulation lines, wherein the conversion elements in each case comprise at least one of the regions of the matrix material.
2. The method according to claim 1 , wherein the converter material comprises a quantum dot wavelength converter.
3. The method according to claim 1 , wherein the barrier substrate is applied as a casting on the matrix material and the carrier substrate.
4. The method according to claim 1 , wherein the carrier substrate and the barrier substrate consist of different materials.
5. The method according to claim 1 , wherein the barrier substrate is deposited on the matrix material and on the carrier substrate from a gas phase.
6. The method according to claim 1 , wherein the application of the matrix material with the converter material is performed by means of a mask, wherein the mask is applied on the carrier substrate.
7. The method according to claim 6 , wherein the mask is removed again after the application of the matrix material.
8. The method according to claim 1 , wherein the application of the matrix material is effected under a protective gas atmosphere or vacuum by means of spray coating, dispersion, printing or jetting.