APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD

1 - 13 . (canceled)

14 . A method for removing at least one component from a circuit board, the method comprising:

providing the circuit board having at least one component attached thereto;

providing a detachment apparatus comprising:

a shaft configured to rotate about a central axis;

at least one lever having a first end and a second end, the at least one lever being attached to the shaft at the first end; and

a hook attached to the second end of the at least one lever;

positioning the detachment apparatus relative to the circuit board;

rotating the detachment apparatus so as to cause the at least one lever to rotate about the central axis of the shaft, thereby causing the hook to come into contact with the at least one component on the circuit board and separate the at least one component from the circuit board; and

severing at least one pin connecting the at least one component to the circuit board by applying sufficient force at the hook.

15 . The method of claim 14 , wherein the circuit board is a waste circuit board.

16 . The method of claim 14 , further comprising subjecting the circuit board to a heat treatment to remove at least some solder material from the circuit board prior to rotating the detachment apparatus.

17 . The method of claim 14 , wherein the at least one component is connected to the circuit board by at least one pin.

18 . (canceled)

19 . The method of claim 14 further comprising moving the detachment apparatus in a direction substantially parallel to a plane of the circuit board.

20 . The method of claim 19 , wherein the direction of the movement of the detachment apparatus and the direction of the rotation of the detachment apparatus are the same.

21 . The method of claim 19 , wherein the direction of the movement of the detachment apparatus and the direction of the rotation of the detachment apparatus are the opposite.

22 . The method of claim 14 , wherein the hook pries the at least one component from the circuit board to separate the at least one component from the circuit board.

23 . The method of claim 14 , wherein at least a portion of the hook is inserted between the circuit board and at least a portion of the at least one component.

24 . The method of claim 14 , wherein the hook engages at least a portion of the at least one component.

25 . The method of claim 14 , wherein the at least one component comprises a through-hole mounted component.

26 . The method of claim 14 , wherein the at least one lever comprises a plurality of levers each having a hook, the plurality of levers secured at their first ends to the shaft and extending in a radial direction away from the central axis of the shaft.

27 - 31 . (canceled)

32 . The method of claim 14 , wherein providing the circuit board having at least one component attached thereto includes positioning the circuit board at a generally vertical orientation.

33 . The method of claim 14 , wherein severing the at least one pin connecting the at least one component to the circuit board includes severing the at least one component from the circuit board.

34 . The method of claim 33 , further comprising allowing the at least one severed component to fall down and away from the circuit board.

35 . A method for removing at least one component from a circuit board, the method comprising:

providing the circuit board having a plurality of components attached thereto;

providing a detachment apparatus comprising:

a shaft configured to rotate about a central axis;

at least one lever having a first end and a second end, the at least one lever being attached to the shaft at the first end; and

a hook attached to the second end of the at least one lever;

positioning the detachment apparatus relative to the circuit board; and

advancing the circuit board into engagement with the hook, thereby removing at least one component of the plurality of components from the circuit board.

36 . The method of claim 35 , wherein removing at least one component of the plurality of components from the circuit board comprises severing the at least one pin connecting the at least one component to the circuit board.

37 . The method of claim 35 , wherein providing the circuit board having at least one component attached thereto comprises positioning the circuit board at a generally vertical orientation.

39 . The method of claim 38 , further comprising allowing the at least one removed component to fall down and away from the circuit board.

40 . The method of claim 39 , further comprising collecting the at least one fallen component.

41 . A method for removing at least one component from a circuit board, the method comprising:

providing the circuit board having at least one component attached thereto;

providing a detachment apparatus comprising:

a shaft configured to rotate about a central axis;

at least one lever having a first end and a second end, the at least one lever being attached to the shaft at the first end; and

a hook attached to the second end of the at least one lever;

positioning the detachment apparatus relative to the circuit board;

subjecting the circuit board to a heat treatment to remove at least some solder material from the circuit board;

after the heat treatment, rotating the detachment apparatus so as to cause the at least one lever to rotate about the central axis of the shaft, thereby causing the hook to come into contact with the at least one component on the circuit board and separate the at least one component from the circuit board; and

severing the at least one component from the circuit board by applying sufficient force at the hook.