Packaged wavelength converted light emitting device
Embodiments of the invention include a plurality of light emitting devices, each light emitting device having a top surface, a bottom surface opposite the top surface, and at least one side surface connecting the top surface and the bottom surface. A wavelength converting layer is disposed in direct contact with the top surface and one side surface of each of the plurality of light emitting devices to mechanically connect each of the plurality of light emitting devices together. The wavelength converting layer is made up of a wavelength converting material, an adhesive material, and a transparent material that has a thermal conductivity of at least 0.2 W/mK. The adhesive material and the transparent material have indices of refraction that vary less than ten percent.
1. A structure comprising:
a plurality of light emitting devices, each of the plurality of light emitting devices having a first surface, a second surface opposite the first surface and not attached to any substrate, and at least one side surface connecting the first surface and the second surface;
a thin wavelength converting layer disposed in direct contact with and conforming to the first surface and at least part of the at least one side surface of each of the plurality of light emitting devices, so that the thin wavelength converting layer comprises a plurality of flat regions respectively disposed over the first surface of each of the plurality of light emitting devices and a plurality of flat side regions perpendicular to the plurality of flat regions, the thin wavelength converting layer comprising depressions formed in spaces between adjacent ones of the plurality of light emitting devices; and
an optical element layer disposed in direct contact with the thin wavelength converting layer;
the plurality of light emitting devices being mechanically connected to each other only through the thin wavelength converting layer and the optical element layer.
2. The structure of claim 1 , wherein the thin wavelength converting layer comprises a mixture of a wavelength converting material, an adhesive material, and a transparent material.
3. The structure of claim 1 , wherein the thin wavelength converting layer has rounded corners.
4. The structure of claim 1 , wherein a horizontal thickness of the thin wavelength converting layer measured from the at least one surface of each of the plurality of light emitting devices to respective surfaces of the plurality of flat regions is 100 μm or less.
5. The structure of claim 2 , wherein the adhesive material and the transparent material having indices of refraction that differ by less than ten percent.
6. The structure of claim 2 , wherein the transparent material makes up at least fifty percent, and less than 100%, of the weight of the thin wavelength converting layer.
7. The structure of claim 2 , wherein the adhesive material makes up greater than 0% and no more than 15% of the weight of the thin wavelength converting layer.
8. The structure of claim 2 , wherein:
the adhesive material and the transparent material having indices of refraction that differ by less than ten percent; and
the transparent material makes up at least fifty percent, and less than 100%, of the weight of the thin wavelength converting layer.
9. The structure of claim 1 , wherein the light emitting devices are configured to be operated from greater than 0.8 A to 1 A.
10. The structure of claim 1 , wherein the optical element layer comprises a mixture of an adhesive material and a transparent material.
11. The structure of claim 1 , wherein the plurality of flat side regions do not directly contact any of the plurality of light emitting devices.
12. The structure of claim 10 , wherein the thin wavelength converting layer has a flat connecting surface extending from one of the plurality of light emitting devices to an adjacent one of the plurality of light emitting devices.
13. The structure of claim 10 , wherein the adhesive material and the transparent material having indices of refraction that differ by less than ten percent.
14. The structure of claim 10 , wherein the transparent material makes up at least fifty percent, and less than 100%, of the weight of the thin wavelength converting layer.
15. The structure of claim 10 , wherein the adhesive material makes up greater than 0% and no more than 15% of the weight of the thin wavelength converting layer.
16. The structure of claim 10 , wherein:
the adhesive material and the transparent material having indices of refraction that differ by less than ten percent; and
the transparent material makes up at least fifty percent, and less than 100%, of the weight of the thin wavelength converting layer;
the adhesive material makes up greater than 0% and no more than 15% of the weight of the thin wavelength converting layer.
17. The structure of claim 1 , wherein a vertical thickness of the thin wavelength converting layer in the spaces between adjacent ones of the thin wavelength converting layer is 100 μm or less.
18. The structure of claim 1 , wherein the thin wavelength converting layer has a thickness greater than 0 μm and less than 100 μm.
19. The structure of claim 1 , wherein the optical element layer fills the depressions in the thin wavelength converting layer.
20. The structure of claim 1 , wherein the thin wavelength converting layer is disposed on all surfaces of each light emitting device other than the second surface.
21. The structure of claim 1 , wherein the plurality of light emitting devices are not mechanically connected to each other through their second surfaces.