Electronic component mounting method

1. An electronic component mounting method comprising:

setting a portion of electronic component mounters as independent production mounters and a remaining portion of the electronic component mounters as second lane dedicated mounters;

deciding initial estimation conditions by provisionally setting all the electronic component mounters as the independent production mounters;

allocating mounting of a first set of electronic components on a first board to a first mounting head of one of the independent production mounters;

allocating mounting of a second set of electronic components on a second board to a second mounting head of the one of the independent production mounters and to a first mounting head and a second mounting head of one of the second lane dedicated mounters,

the electronic component mounting method being a method in which at least one of a component quantity or component types are different for the first set of electronic components to be mounted on the first board and the second set of electronic components to be mounted on the second board, and using an electronic component mounting system in which the electronic component mounters are arranged in series with respective first conveyance lanes of the electronic component mounters connected in series and respective second conveyance lanes of the electronic component mounters connected in series, the electronic component mounters each including a board conveyance device including the first conveyance lane that loads and unloads the first board and the second conveyance lane that loads and unloads the second board,

the first mounting head, provided adjacent to the first conveyance lane, configured to mount the first set of electronic components on the first board loaded on the first conveyance lane and to mount the second set of electronic components on the second board loaded on the second conveyance lane, and

the second mounting head, provided adjacent to the second conveyance lane, configured to mount the first set of electronic components on the first board loaded on the first conveyance lane and to mount the second set of electronic components on the second board loaded on the second conveyance lane;

determining whether a first production required time obtained by multiplying a first lane cycle time by a first production quantity, and a second production required time obtained by multiplying a second lane cycle time by a second production quantity are approximately the same,

while the first production required time is smaller than the second production required time, changing the initial estimation conditions to a changed estimation condition by changing settings so as to allocate one of the independent production mounters at that point as the second lane dedicated mounter; and

when the first production required time becomes larger than or substantially the same as the second production required time, allocates the multiple component mounters as the independent production mounters and the second lane dedicated mounters based on the changed estimation conditions.

2. The electronic component mounting method according to claim 1 , further including

allocating the electronic component mounters as the independent production mounters and the second lane dedicated mounters such that the first production required time that is an estimate of a time required to produce a first production quantity of the first board and the second production required time that is an estimate of a time required to produce a second production quantity of the second board are substantially the same,

wherein the first production quantity, which is a quantity of the first board to be produced, and the second production quantity, which is a quantity of the second board to be produced, are predetermined.

3. The electronic component mounting method according to claim 1 , further including

a cycle time estimating step of allocating the first set of electronic components to the first mounting heads of the independent production mounters at that point, estimating a first individual machine cycle time that is a time required for mounting onto the first board for each of the independent production mounters, then taking a largest value of the first individual machine cycle time as a first lane cycle time, allocating the second set of electronic components to the second mounting heads of the independent production mounters at that point and to the first mounting heads and the second mounting heads of the second lane dedicated mounters at that point, estimating a second individual machine cycle time that is a time required for mounting onto the second board for each of the electronic component mounters, and then taking a largest value of the second individual machine cycle time as a second lane cycle time.

4. The electronic component mounting method according to claim 3 , wherein

in the cycle time estimation step, the first set of electronic components are appropriately allocated to the first mounting heads of the independent component mounters at that point such that the first individual machine cycle times of each of the independent component mounters approximately balances, and the second set of electronic components are appropriately allocated to the second mounting heads of the independent component mounters at that point and to the first mounting heads and the second mounting heads of the second lane dedicated mounters at that point such that the second individual machine cycle times of each of the multiple component mounters approximately balances.

5. The electronic component mounting method according to claim 3 , wherein

the electronic component mounter with the largest value of the second individual machine cycle time from among the independent production mounters at that point, or the electronic component mounter for which the second mounting head has a largest value of quantity of the electronic components allocated from among the independent production mounters at that point, is allocated as the second lane dedicated mounter.

6. The electronic component mounting method according to claim 1 , wherein

the first board is a bottom surface of a double-sided board, and the second board is a top surface of the double-sided board.