IP Library Granted Patent US 10,798,949
Granted Patent B2
US 10,798,949 · App. 15/319,901 · Granted Oct 13, 2020

Apparatus and method for the decoration of foodstuffs

Inventors: James Richard Hughes Leach (St Neots, GB); Jonathan David Morley (Letchworth, GB)
Assignee: Conopco, Inc.
A23G3/28A21D13/45A21D13/47A23G3/0097
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,798,949
App. No.
15/319,901
Granted
Oct 13, 2020
Kind
B2
Abstract

The present invention provides a wafer product decorating apparatus comprising a laser, a collimator, at least one galvanometer driven mirror, and an aspheric scan lens, the apparatus being positionable relative to the wafer product to be decorated wherein the apparatus is configured to provide a laser beam having a spot size of from 100 to 750 μm in diameter on the surface of the product to be decorated and a substantially flat focal plane, characterised in that the focal plane has a depth of field of from 5 mm to 20 mm and that the focal plane of the laser beam is from 5 mm to 30 mm above or below the surface of the product to be decorated. The invention also provides a process for decorating a wafer product.

Claims (12)

1. A wafer product decorating apparatus comprising a laser ( 6 ), a collimator ( 7 ), at least one galvanometer driven mirror ( 8 ), and an aspheric scan lens ( 9 ), the apparatus being positionable relative to the wafer product to be decorated wherein the apparatus is configured to provide a laser beam having

a spot size of from 100 to 750 μm in diameter on the surface of the product to be decorated and

a substantially flat focal plane,

characterised in that

the focal plane has a depth of field of from 5 mm to 20 mm and that

the focal plane of the laser beam is from 5 mm to 30 mm above or below the surface of the product to be decorated, wherein the wafer product is a cone.

2. An apparatus according to claim 1 wherein the laser is a CO2 laser.

3. An apparatus according to claim 1 wherein the spot size is from 150 μm to 700 μm in diameter.

4. An apparatus according to any of claim 1 wherein the spot size is from 250 μm to 600 μm in diameter.

5. An apparatus according to claim 1 wherein the focal plane of the laser beam is from 7.5 mm to 27.5 mm above the surface of the wafer-based product that is to be decorated.

6. An apparatus according to claim 1 wherein the focal plane of the laser beam is from 7.5 mm to 27.5 mm below the surface of the wafer-based product that is to be decorated.

7. An apparatus according to claim 1 wherein the depth of field of the focal plane is from 5.5 mm to 17.5 mm.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE CHANGE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 73078 FRAME 700. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 26, 2026
From: CONOPCO, INC., D/B/A UNILEVER
To: MAGNUM ICC US, LCC
Reel/Frame 074510/0542 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2025
From: CONOPCO, INC., D/B/A UNILEVER
To: MAGNUM US ICC, LCC
Reel/Frame 073078/0700 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2017
From: LEACH, JAMES RICHARD HUGHES; MORLEY, JONATHAN DAVID
To: CONOPCO, INC., D/B/A UNILEVER
Reel/Frame 040840/0377 →
Priority Claims (1)
EP 14174672 · Jun 27, 2014 · regional
Continuity (1)
Related Publication 20170181445A1 · Jun 29, 2017