IN MOLD DECORATION OF A FILM LAMINATED SUBSTRATE
An article of manufacturing can comprise a mold insert comprising: a cap substrate having a first surface and a second surface; an adhesive coupled to a portion of the second surface of the cap substrate; a base substrate having a first surface and a second surface, wherein the first surface of the base substrate is coupled to the adhesive, wherein the adhesive is disposed between the second surface of the cap substrate and the first surface of the base substrate; and a polymeric resin attachment, wherein the polymeric resin attachment is coupled to a portion of the second surface of the base substrate, wherein the polymeric resin extends along an edge of the base substrate, and along an edge of the cap substrate.
1 . An article of manufacturing comprising:
a mold insert comprising:
a cap substrate having a first surface and a second surface;
an adhesive coupled to a portion of the second surface of the cap substrate;
a base substrate having a first surface and a second surface, wherein the first surface of the base substrate is coupled to the adhesive, wherein the adhesive is disposed between the second surface of the cap substrate and the first surface of the base substrate; and
a polymeric resin attachment, wherein the polymeric resin attachment is coupled to a portion of the second surface of the base substrate, wherein the polymeric resin extends along an edge of the base substrate, and along an edge of the cap substrate.
2 . The article of claim 1 , wherein a front side of the article comprises the first surface of the cap substrate and a portion of the polymeric resin attachment, and wherein the first surface of the cap substrate and the polymeric resin attachment are flush along the front side of the article.
3 . The article of claim 1 , wherein the polymeric resin attachment comprises filler material, and wherein the filler material comprises carbon fiber, glass fiber, aramid fiber, basalt fiber, quartz fiber, boron fiber, cellulose fiber, natural fiber, liquid crystal polymer fiber, high tenacity polymer fiber (e.g., polypropylene, polyethylene, poly(hexano-6-lactam), poly[imino(1,6-dioxohexamethylene) imnohexamethylene]), or a combination comprising at least one of the foregoing.
4 . The article of claim 1 , wherein the polymeric resin attachment comprises carbon fiber in an amount of 5 wt. % to 25 wt. % of the total weight of the polymeric resin attachment.
5 . The article of claim 1 , wherein the polymeric resin attachment comprises glass fiber in an amount of 5 wt. % to 35 wt. % of the total weight of the polymeric resin attachment.
6 . The article of claim 1 , wherein the polymeric resin attachment comprises glass bead in an amount of 5 wt. % to 35 wt. % of the total weight of the polymeric resin attachment.
7 . The article of claim 1 , wherein the cap substrate comprises a glass, a wood, a metal, a fiber sheet, or a combination comprising at least one of the forgoing.
8 . The article of claim 1 , wherein the cap substrate comprises glass and the cap substrate has a thickness as measured along the shortest dimension of the cap substrate of 0.05 mm to 1 mm; or wherein the cap substrate comprises chemically strengthened glass and the cap substrate has a thickness as measured along the shortest dimension of 0.3 mm to 1 mm; or wherein the cap substrate comprises non-strengthened glass and the cap substrate has a thickness as measured along the shortest dimension of 0.05 mm to 0.3 mm; or wherein the cap substrate comprises optically transparent synthetic crystal and the cap substrate has a thickness as measured along the shortest dimension of 0.06 mm to 2 mm.
9 . The article of claim 1 , wherein the base substrate comprises polycarbonate, polyester, polypropylene, poly(methyl methacrylate), polycarbonate-dimethyl bisphenol cyclohexane, polyestercarbonate, polyetherimide, or a combination comprising at least one of the foregoing.
10 . The article of claim 1 , further comprising a functional layer, wherein the functional layer is disposed between the adhesive and the first surface of the base substrate; or wherein the functional layer is disposed between the adhesive and the second surface of the cap substrate.
11 . The article of claim 1 , wherein the polymeric resin attachment forms a border that surrounds the mold insert in at least one dimension.
12 . The article of claim 1 , wherein the adhesive comprises epoxy, acrylate, amine, urethane, silicone, thermal plastic urethane, ethyl vinyl acetate, HALS free EVA, or a combination comprising at least one of the foregoing.
13 . A housing for an electronic device comprising the article of claim 1 .
14 . An electronic device comprising an electronic component and the article of claim 1 , wherein the electronic component is housed inside the article.
15 . The electronic device of claim 14 , wherein the electronic device comprises a mobile phone, electronic tablet, e-reader, or a combination comprising at least one of the foregoing.
16 . A shelf for an appliance, a face shield, or an automotive interface comprising the article of claim 1 .
17 . A method for forming an article of manufacturing comprising:
applying an adhesive to a surface of a first substrate;
coupling a second substrate to the adhesive to form a mold insert, wherein the adhesive is sandwiched between the first substrate and the second substrate;
molding a polymeric resin attachment to the mold insert in an injection molding process to form an article; wherein the polymeric resin attachment is coupled to a portion of one of the first substrate and second substrate, and wherein the polymeric resin attachment extends along a portion of an edge of the mold insert.
18 . The method of claim 17 , further comprising applying a functional layer to one of the first substrate and second substrate.
19 . The method of claim 17 , further comprising mixing a functional material with the adhesive.
20 . The method of claim 17 , further comprising printing an image onto a second surface of one of the first substrate or second substrate; wherein the image is disposed between the first substrate and the second substrate.