An object of the present invention is to provide a power module having high reliability. The power module according to the present invention, includes a circuit body and a case housing the circuit body. The case has a first case member including a first base plate and a second case member including a second base plate. The first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate. The second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion. The first side wall portion and the second side wall portion are formed so as to have the sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than the thickness of the circuit body. The first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.
1. A power module comprising:
a circuit body having a power semiconductor element; and
a case housing the circuit body,
wherein the case has:
a first case member including a first base plate facing one surface of the circuit body; and
a second case member including a second base plate facing another surface on a side opposite to the one surface of the circuit body,
the first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate,
the second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion,
the first side wall portion and the second side wall portion are formed so as to have a sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than a thickness of the circuit body, and
the first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.
2. The power module according to claim 1 ,
wherein a thickness of the deforming portion is smaller than a thickness of the first base portion.
3. The power module according to claim 1 ,
wherein the deforming portion is coupled to a position apart from a center of the first base plate in a thickness direction.
4. The power module according to claim 3 , wherein the first base plate includes a fin formed on a surface on a side on which the circuit body is arranged, and the coupling position between the deforming portion and the first base plate.
5. The power module according to claim 1 ,
wherein the deforming portion is coupled to a center position of the first base plate in a thickness direction.
6. The power module according to claim 1 ,
wherein the first side wall portion and the second side wall portion are formed so as to have a distance between a surface of the first base portion and a surface of the second base portion larger than the sum of the lengths of the first side wall portion and the second side wall portion.
7. The power module according to claim 1 ,
wherein the first side wall portion has a first protruding portion protruding in a direction moving away from the circuit body,
the second side wall portion has a second protruding portion protruding in a direction moving away from the circuit body, the second protruding portion being in contact with the first protruding portion, and
the first protruding portion is joined to the second protruding portion.