Optoelectronic component and a method for producing an optoelectronic component

1. An optoelectronic component, comprising:

a first electrode comprising at least one outer electrode segment which is formed at a lateral edge of the first electrode, and at least one inner electrode segment which is formed in a manner spaced apart from the lateral edge of the first electrode,

an electrically conductive current distribution structure formed above the first electrode and comprising at least one outer substructure which extends at least over the outer electrode segment, and at least one inner substructure which extends at least over the inner electrode segment and which is electrically insulated from the outer substructure,

at least one current lead which extends from the lateral edge of the first electrode toward the inner substructure, which is electrically coupled to the inner substructure, which is electrically insulated from the outer substructure and which structure corresponds to the current distribution structure,

an insulation structure, which covers the current distribution structure and the current lead,

an organic functional layer structure above the first electrode, the current distribution structure, the current lead and the insulation structure, and a second electrode above the organic functional layer structure.

2. The optoelectronic component as claimed in claim 1 , wherein the structure of the current lead is geometrically similar to the current distribution structure.

3. The optoelectronic component as claimed in claim 1 , wherein the current distribution structure is formed in an integral fashion and comprises a plurality of rectilinear current distribution sections, and wherein the current lead runs adjacent to the current distribution sections.

4. The optoelectronic component as claimed in claim 3 , wherein the current lead runs laterally alongside or perpendicularly above the current distribution sections.

5. The optoelectronic component as claimed in claim 3 , wherein the current lead runs parallel to the current distribution sections.

6. The optoelectronic component as claimed in claim 1 , wherein the current lead is formed integrally with the inner substructure.

7. The optoelectronic component as claimed in claim 1 , wherein the outer electrode segment is formed between the lateral edge of the first electrode and the inner electrode segment.

8. The optoelectronic component as claimed in claim 7 , wherein the inner electrode segment is surrounded in a lateral direction by said one outer electrode segment, a further outer electrode segment and/or a plurality of outer electrode segments.

9. The optoelectronic component as claimed in claim 1 , wherein a current distribution section of the current distribution structure and a current lead section of the current lead are covered by an integral insulation structure section of the insulation structure.

10. The optoelectronic component as claimed in claim 1 , wherein a current distribution section of the current distribution structure is covered by a first insulation structure section of the insulation structure and a current lead section of the current lead is covered by a second insulation structure section of the insulation structure, wherein the first and second insulation structure sections are physically separated from one another.

11. A method for producing an optoelectronic component, wherein

a first electrode is provided, comprising at least one outer electrode segment which is formed at a lateral edge of the first electrode, and at least one inner electrode segment which is formed in a manner spaced apart from the lateral edge of the first electrode,

an electrically conductive current distribution structure is formed above the first electrode, said electrically conductive current distribution structure comprising at least one outer substructure which extends at least over the outer electrode segment, and at least one inner substructure which extends at least over the inner electrode segment and which is electrically insulated from the outer substructure, at least one current lead is formed which extends from the lateral edge of the first electrode toward the inner substructure, which is electrically coupled to the inner substructure, which is electrically insulated from the outer substructure and whose structure corresponds to the current distribution structure,

an insulation structure is formed above the current distribution structure and the current lead,

an organic functional layer structure is formed above the first electrode, the current distribution structure, the current lead and the insulation structure, and a second electrode is formed above the organic functional layer structure.

12. The method as claimed in claim 11 , wherein the electrode segments are formed by the first electrode firstly being formed in an integral fashion and then being severed such that the electrode segments are formed.

13. The method as claimed in claim 11 , wherein the current distribution structure is formed by the current distribution structure firstly being formed in an integral fashion and then being severed such that the substructures are formed.

14. The method as claimed in claim 11 , wherein the current lead is formed by the current distribution structure.

15. The method as claimed in claim 11 , wherein the current lead is formed in addition to the current distribution structure.