Imaging device with improved heat dissipation including a board section between a first and a second housing
View Patent ↗An imaging device including a board section on which imaging element is loaded, a first housing section for fixing board section from a surface on which imaging element is loaded; a second housing section for fixing board section from a surface opposite to the surface on which imaging element is loaded; and a lens section attached to the first housing section side; and the first housing section and the second housing section are fixed by attachment members so as to sandwich board section. The first housing section may be configured from board fixing member for fixing board section, and the lens attachment member for attaching lens section that is fixed to board fixing member in a positionally adjustable manner.
1. An imaging device comprising:
a board section on which an imaging element is loaded, the board section including a first through hole and a conductor body pattern formed on an edge surface of a top side of the board section;
a first housing section for fixing the board section from a surface on which the imaging element is loaded, the first housing section including a screw hole;
a second housing section for fixing the board section from a surface opposite to the surface on which the imaging element is loaded, the second housing section including a second through hole;
a lens section attached to the first housing section; and
an attachment member that extends through the second through hole, extends through the first through hole, and screws into the screw hole to fix the first housing section and the second housing section so as to sandwich the board section,
wherein the conductor body pattern is connected to a ground potential of the board section, and one of the first housing section and the second housing section contact the conductor body pattern when fixed to the board section,
wherein the conductor body pattern is a first conductor body pattern and the board section includes a second conductor body pattern on an edge surface of a bottom side of the board section that is opposite to the top side,
wherein the first conductor body pattern contacts the first housing section when fixed to the board section and the second conductor body pattern contacts the second housing section when fixed to the board section,
wherein the first conductor body pattern and the second conductor body pattern are each formed in the board section and covered by a protective layer at portions other than the edge surface of the top side and the bottom side of the board section, respectively,
wherein the board section includes a control board formed from a glass-epoxy board and the protective layer is formed by a resist on a top side and on a bottom side of the control board, and
wherein the first conductor body pattern and the second conductor body pattern are formed by copper wiring in the glass-epoxy board exposed by removal of the protective layer.
2. The imaging device according to claim 1 , wherein
the first housing section and the second housing section configure an outside wall of the imaging device.
3. The imaging device according to claim 1 , wherein
the first housing section includes a board fixing member for fixing the board section, and a lens attachment member for attaching the lens section, the lens attachment member being fixed to the board fixing member in a positionally adjustable manner.
4. The imaging device according to claim 3 , wherein
the board fixing member of the first housing section, and the second housing section, are formed from a metal with high heat dissipation properties such as aluminum.
5. The imaging device according to claim 3 , wherein
the first housing section includes a shim between seating surfaces of the board fixing member and the lens attachment member.
6. The imaging device according to claim 1 , wherein
the attachment member extends in a direction parallel to an optical axis of the lens section.