Electronic component, leadframe, and method for producing an electronic component

1. An electronic component comprising:

a housing; and

a leadframe section partly embedded in the housing,

wherein the leadframe section comprises a first quadrant, a second quadrant, a third quadrant and a fourth quadrant,

wherein each of the quadrants comprises a first leadframe part and a second leadframe part,

wherein each first leadframe part comprises a chip landing area,

wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section,

wherein the four quadrants are configured symmetrically with respect to one another, and

wherein all leadframe parts of all four quadrants are electrically isolated from one another.

2. The electronic component according to claim 1 , wherein the four quadrants are configured rotationally symmetrically with respect to one another.

3. The electronic component according to claim 1 , wherein the chip landing area of each first leadframe part comprises a first outer edge and a second outer edge, wherein the first outer edge of the first leadframe part of the first quadrant is arranged parallel and directly adjacently to the second outer edge of the first leadframe part of the second quadrant, and wherein the second outer edge of the first leadframe part of the first quadrant is arranged parallel and directly adjacently to the first outer edge of the first leadframe part of the fourth quadrant.

4. The electronic component according to claim 1 , wherein in each case an optoelectronic semiconductor chip is arranged on each chip landing area, and wherein each optoelectronic semiconductor chip is electrically conductively connected to the second leadframe part of the respective quadrant.

5. The electronic component according to claim 4 , wherein chip edges of the optoelectronic semiconductor chips are oriented substantially parallel to outer edges of the chip landing areas.

6. The electronic component according to any one of claim 1 , further comprising a protective chip arranged on a chip landing area of a quadrant, the protective chip being electrically conductively connected to the second leadframe part of the quadrant.

7. The electronic component according to claim 1 , wherein the first leadframe part of the first quadrant is arranged between the second leadframe part of the first quadrant and the second leadframe part of the second quadrant.

8. The electronic component according to claim 1 , wherein the first leadframe part of the first quadrant is arranged between the second leadframe part of the first quadrant and the second leadframe part of the fourth quadrant.

9. A method for producing an electronic component, the method comprising:

providing a leadframe according to claim 1 ;

embedding the leadframe section into the housing; and

arranging, in each case, an optoelectronic semiconductor chip on the chip landing area of each first leadframe part of the leadframe section.

10. A leadframe comprising:

a first leadframe section comprising a first quadrant, a second quadrant, a third quadrant and a fourth quadrant; and

a second leadframe section and a third leadframe section, which have the same configuration as the first leadframe section,

wherein each of the quadrants comprises a first leadframe part and a second leadframe part,

wherein each first leadframe part comprises a chip landing area for receiving an electronic semiconductor chip,

wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the first leadframe section,

wherein the four quadrants are configured symmetrically with respect to one another, and

wherein the first leadframe part of the first quadrant of the first leadframe section is configured integrally continuously with the first leadframe part of the third quadrant of the second leadframe section and with the second leadframe part of the fourth quadrant of the third leadframe section.

11. The leadframe according to claim 10 , wherein the second leadframe part of the first quadrant of the first leadframe section is configured integrally continuously with the first leadframe part of the second quadrant of the second leadframe section, with the second leadframe part of the second quadrant of the second leadframe section and with the second leadframe part of the fourth quadrant of the third leadframe section.

12. A leadframe comprising:

a first leadframe section comprising a first quadrant, a second quadrant, a third quadrant and a fourth quadrant; and

a second leadframe section and a third leadframe section, which have the same configuration as the first leadframe section,

wherein each of the quadrants comprises a first leadframe part and a second leadframe part,

wherein each first leadframe part comprises a chip landing area for receiving an electronic semiconductor chip,

wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the first leadframe section,

wherein the four quadrants are configured symmetrically with respect to one another,

wherein the second leadframe part of the first quadrant of the first leadframe section is configured integrally continuously with the first leadframe part of the second quadrant of the second leadframe section, with the second leadframe part of the second quadrant of the second leadframe section and with the second leadframe part of the fourth quadrant of the third leadframe section.