IP Library Granted Patent US 10,352,904
Granted Patent B2
US 10,352,904 · App. 15/334,511 · Granted Jul 16, 2019

Acoustic resonator devices and methods providing patterned functionalization areas

Inventors: Rio Rivas (Bend, OR); John Belsick (Bend, OR); Matthew Ryder (Bend, OR)
Assignee: QORVO US, INC.
G01N29/036H03H3/02H03H9/175G01N2291/0426
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Quick Facts
Patent No.
US 10,352,904
App. No.
15/334,511
Granted
Jul 16, 2019
Kind
B2
Abstract

A micro-electrical-mechanical system (MEMS) resonator device includes a top side electrode overlaid with an interface layer including a material having a surface (e.g., gold or other noble metal, or a hydroxylated oxide) that may be functionalized with a functionalization (e.g., specific binding or non-specific binding) material. The interface layer and/or an overlying blocking material layer are precisely patterned to control locations of the interface layer available to receive a self-assembled monolayer (SAM), thereby addressing issues of misalignment and oversizing of a functionalization zone that would arise by relying solely on microarray spotting. Atomic layer deposition may be used for deposition of the interface layer and/or an optional hermeticity layer. Sensors and microfluidic devices incorporating MEMS resonator devices are also provided.

Claims (33)

1. A micro-electrical-mechanical system (MEMS) resonator device comprising:

a substrate;

a bulk acoustic wave resonator structure arranged over at least a portion of the substrate, the bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and the substrate, wherein a portion of the piezoelectric material is between the top side electrode and the bottom side electrode to form an active region; an interface layer arranged over at least a portion of the active region, wherein less than an entirety of the piezoelectric material is overlaid with interface layer material that is available to receive a self-assembled monolayer (SAM); and

the self-assembled monolayer arranged over at least a portion of the interface layer.

2. The MEMS resonator device of claim 1 , wherein the interface layer comprises a hydroxylated oxide surface, and the self-assembled monolayer comprises an organosilane material.

3. The MEMS resonator device of claim 1 , wherein the interface layer comprises gold or another noble metal, and the self-assembled monolayer comprises a thiol material.

4. The MEMS resonator device of claim 1 , wherein the interface layer is arranged over less than an entirety of the piezoelectric material.

5. The MEMS resonator device of claim 1 , further comprising a patterned blocking layer arranged over at least one portion of the interface layer.

6. The MEMS resonator device of claim 5 , wherein the patterned blocking layer comprises at least one of silicon nitride, silicon carbide, photoresist, SU-8, polyimide, parylene, or poly (ethylene glycol).

7. The MEMS resonator device of claim 1 , further comprising at least one functionalization material arranged over at least a portion of the self-assembled monolayer, wherein at least a portion of the at least one functionalization material is registered with the active region.

8. The MEMS resonator device of claim 1 , wherein the top side electrode comprises a non-noble metal, and the MEMS resonator device further comprises a hermeticity layer arranged between the interface layer and the top side electrode.

9. The MEMS resonator device of claim 8 , wherein the hermeticity layer comprises an oxide, a nitride, or an oxynitride dielectric material, and the hermeticity layer comprises a water vapor transmission rate of no greater than 0.1 (g/m 2 /day).

10. The MEMS resonator device of claim 1 , wherein the piezoelectric material comprises a hexagonal crystal structure piezoelectric material that comprises a c-axis having an orientation distribution that is predominantly non-parallel to normal of a face of the substrate.

11. A sensor comprising the MEMS resonator device of claim 1 .

12. A fluidic device comprising the MEMS resonator device of claim 7 , and a fluidic passage arranged to conduct a liquid to contact the at least one functionalization material.

13. A method for biological or chemical sensing, the method comprising:

supplying a fluid containing a target species into the fluidic passage of a fluidic device according to claim 12 , wherein said supplying is configured to cause at least some of the target species to bind to the at least one functionalization material;

inducing a bulk acoustic wave in the active region; and

sensing a change in at least one of a frequency property, a magnitude property, or a phase property of the bulk acoustic wave resonator structure to indicate at least one of presence or quantity of target species bound to the at least one functionalization material.

14. A micro-electrical-mechanical system (MEMS) resonator device comprising:

a substrate;

a bulk acoustic wave resonator structure arranged over at least a portion of the substrate, the bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and the substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region;

a self-assembled monolayer arranged over at least a portion of the active region; and

at least one functionalization material arranged over at least a portion of the self-assembled monolayer, wherein less than an entirety of the piezoelectric material is overlaid with the at least one functionalization material.

15. A method for fabricating a micro-electrical-mechanical system (MEMS) resonator device, the method comprising:

forming a bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and a substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region;

depositing an interface layer over at least a portion of the active region, wherein less than an entirety of the piezoelectric material is overlaid with interface layer material that is available to receive a self-assembled monolayer (SAM); and

forming a self-assembled monolayer over at least a portion of the interface layer, wherein at least a portion of the self-assembled monolayer is arranged over the active region.

16. The method of claim 15 , further comprising applying a patterned mask over at least a portion of the bulk acoustic wave resonator structure prior to the depositing of the interface layer.

17. The method of claim 15 , further comprising depositing at least one functionalization material over at least a portion of the self-assembled monolayer, wherein the at least one functionalization material is registered with at least a portion of the active region.

18. The method of claim 15 , wherein the top side electrode comprises a non-noble metal, and the method further comprises depositing a hermeticity layer between at least portions of the interface layer and the top side electrode, wherein the hermeticity layer comprises an oxide, a nitride, or an oxynitride dielectric material, and wherein the hermeticity layer comprises a water vapor transmission rate of no greater than 0.1 (g×mm)/(m 2 ×day).

19. The method of claim 15 , further comprising depositing a patterned blocking layer over at least one portion of the interface layer.

20. The method of claim 15 , further comprising forming at least one wall over a portion of the bulk acoustic wave resonator structure and defining a fluidic passage containing the active region.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2023
From: QORVO BIOTECHNOLOGIES, LLC
To: QORVO US, INC.
Reel/Frame 065124/0556 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2018
From: QORVO US, INC.
To: QORVO BIOTECHNOLOGIES, LLC
Reel/Frame 047794/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2016
From: RIVAS, RIO; BELSICK, JOHN; RYDER, MATTHEW
To: QORVO US, INC.
Reel/Frame 040177/0183 →
Continuity (2)
Provisional Application 62246302 · Oct 26, 2015
Related Publication 20170117871A1 · Apr 27, 2017
Cited By (1)
US 12,458,969