IP Library Granted Patent US 10,224,442
Granted Patent B2
US 10,224,442 · App. 15/334,706 · Granted Mar 5, 2019

Metallization of solar cells with differentiated P-type and N-type region architectures

Inventors: David D. Smith (Campbell, CA); Timothy Weidman (Sunnyvale, CA); Scott Harrington (Oakland, CA); Venkatasubramani Balu (Santa Clara, CA)
Assignee: SunPower Corporation
H01L31/022441H01L31/02167H01L31/02363H01L31/02366H01L31/035281H01L31/0745Y02E10/50
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Quick Facts
Patent No.
US 10,224,442
App. No.
15/334,706
Granted
Mar 5, 2019
Kind
B2
Abstract

Methods of fabricating solar cell emitter regions with differentiated P-type and N-type regions architectures, and resulting solar cells, are described. In an example, a back contact solar cell can include a substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region of a first conductivity type is disposed on a first thin dielectric layer disposed on the back surface of the substrate. A second polycrystalline silicon emitter region of a second, different, conductivity type is disposed on a second thin dielectric layer disposed on the back surface of the substrate. A third thin dielectric layer is disposed over an exposed outer portion of the first polycrystalline silicon emitter region and is disposed laterally directly between the first and second polycrystalline silicon emitter regions. A first conductive contact structure is disposed on the first polycrystalline silicon emitter region. A second conductive contact structure is disposed on the second polycrystalline silicon emitter region. Metallization methods, include etching techniques for forming a first and second conductive contact structure are also described.

Claims (44)

1. A back contact solar cell, comprising:

a substrate having a light-receiving surface and a back surface;

a first polycrystalline silicon emitter region of a first conductivity type disposed on a first thin dielectric layer disposed on the back surface of the substrate, wherein the first thin dielectric layer is sandwiched by and is directly contacting the substrate and the first polysilicon emitter region;

a second polycrystalline silicon emitter region of a second, different, conductivity type disposed on a second thin dielectric layer disposed on the back surface of the substrate;

a third thin dielectric layer disposed over an exposed outer portion of the first polycrystalline silicon emitter region and disposed laterally directly between the first and second polycrystalline silicon emitter regions, wherein the lateral region of the third thin dielectric layer is sandwiched by and is directly contacting the first and second polycrystalline silicon emitter regions;

a first conductive contact structure disposed over the first polycrystalline silicon emitter region; and

a second conductive contact structure disposed over the second polycrystalline silicon emitter region.

2. The back contact solar cell of claim 1 , further comprising:

an insulator layer disposed on the first polycrystalline silicon emitter region, wherein the first conductive contact structure is disposed through the insulator layer, and wherein a portion of the second polycrystalline silicon emitter region overlaps the insulator layer but is separate from the first conductive contact structure.

3. The back contact solar cell of claim 2 , wherein the insulator layer comprises an oxynitride or a nitride.

4. The back contact solar cell of claim 1 , further comprising:

an amorphous silicon region disposed over the second polycrystalline silicon emitter region.

5. The back contact solar cell of claim 1 , further comprising:

a silicon nitride region disposed over the second polycrystalline silicon emitter region.

6. The back contact solar cell of claim 1 , further comprising:

an insulator layer disposed on the first polycrystalline silicon emitter region; and a polycrystalline silicon layer of the second conductivity type disposed on the insulator layer, wherein the first conductive contact structure is disposed through the polycrystalline silicon layer of the second conductivity type and through the insulator layer.

7. The back contact solar cell of claim 1 , wherein the second polycrystalline silicon emitter region and the second thin dielectric layer are disposed in a recess disposed in the substrate.

8. The back contact solar cell of claim 7 , wherein the recess has a texturized surface.

9. The back contact solar cell of claim 1 , wherein the first polycrystalline silicon emitter region and the first thin dielectric layer are disposed on a flat portion of the back surface of the substrate, and wherein the second polycrystalline silicon emitter region and the second thin dielectric layer are disposed on a texturized portion of the back surface of the substrate.

10. The back contact solar cell of claim 1 , wherein the first and second conductive contact structures each comprises an aluminum-based metal seed layer disposed on the first and second polycrystalline silicon emitter regions, respectively, and each further comprises a metal layer disposed on the aluminum-based metal seed layer.

11. The back contact solar cell of claim 1 , further comprising:

a fourth thin dielectric layer disposed on the light-receiving surface of the substrate;

a polycrystalline silicon layer of the second conductivity type disposed on the fourth thin dielectric layer; and

an anti-reflective coating (ARC) layer disposed on the polycrystalline silicon layer of the second conductivity type.

12. The back contact solar cell of claim 1 , wherein the substrate is an N-type monocrystalline silicon substrate, the first conductivity type is P-type, and the second conductivity type is N-type.

13. The back contact solar cell of claim 1 , wherein all of the first, second and third thin dielectric layers comprise silicon dioxide.

14. The back contact solar cell of claim 1 , wherein the second polycrystalline silicon emitter region is disposed on a portion of the third thin dielectric layer disposed over the exposed outer portion of the first polycrystalline silicon emitter region.

15. A back contact solar cell, comprising:

a substrate having a light-receiving surface and a back surface;

a P-type emitter region disposed on a first thin dielectric layer disposed on the back surface of the substrate, wherein the first thin dielectric layer is sandwiched by and is directly contacting the substrate and the P-type emitter region;

an N-type emitter region disposed on a second thin dielectric layer disposed on the back surface of the substrate;

a third thin dielectric layer disposed over an exposed outer portion of the P-type emitter region and disposed laterally directly between the P-type and the N-type emitter regions, wherein the lateral region of the third thin dielectric layer is sandwiched by and is directly contacting the P-type and the N-type emitter regions;

a first conductive contact structure disposed over the P-type emitter region; and a second conductive contact structure disposed over the N-type emitter region.

16. The back contact solar cell of claim 15 , wherein the N-type emitter region and the second thin dielectric layer are disposed in a recess disposed in the substrate, and wherein the recess has a texturized surface.

17. The back contact solar cell of claim 15 , wherein the N-type emitter region is disposed on a portion of the third thin dielectric layer disposed over the exposed outer portion of the P-type emitter region.

18. A back contact solar cell, comprising:

a substrate having a light-receiving surface and a back surface;

an N-type emitter region disposed on a first thin dielectric layer disposed on the back surface of the substrate, wherein the first thin dielectric layer is sandwiched by and is directly contacting the substrate and the N-type emitter region;

a P-type emitter region disposed on a second thin dielectric layer disposed on the back surface of the substrate;

a third thin dielectric layer disposed over an exposed outer portion of the N-type emitter region and disposed laterally directly between the N-type and the P-type emitter regions, wherein the lateral region of the third thin dielectric layer is sandwiched by and is directly contacting the P-type and the N-type emitter regions;

a first conductive contact structure disposed over the N-type emitter region; and

a second conductive contact structure disposed over the P-type emitter region.

19. The back contact solar cell of claim 18 , wherein the P-type emitter region and the second thin dielectric layer are disposed in a recess disposed in the substrate, and wherein the recess has a texturized surface.

20. The back contact solar cell of claim 18 , wherein the P-type emitter region is disposed on a portion of the third thin dielectric layer disposed over the exposed outer portion of the N-type emitter region.

Assignments (4)
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062699/0875 →
Continuity (2)
Division 15089382 · Apr 1, 2016
Related Publication 20170288074A1 · Oct 5, 2017