Light-emitting device

1. A light-emitting device, comprising:

a first light-emitting semiconductor stack comprising a first active layer;

a second light-emitting semiconductor stack below the first light-emitting semiconductor stack, wherein the second light-emitting semiconductor stack comprises a second active layer;

a reflector between the first light-emitting semiconductor stack and the second light-emitting semiconductor stack;

a protecting layer between the reflector and the second light-emitting semiconductor stack; and

a first current spreading layer between the protecting layer and the second light-emitting semiconductor stack;

wherein the first active layer emits a first radiation of a first wavelength, and the second active layer emits a second radiation of a second wavelength longer than the first wavelength,

wherein the first light-emitting semiconductor stack further comprises a first semiconductor layer and a second semiconductor layer sandwiching the first active layer, the second light-emitting semiconductor stack further comprises a third semiconductor layer and a fourth semiconductor layer sandwiching the second active layer, wherein the second semiconductor layer has a first band gap, the third semiconductor layer has a second band gap, and the protecting layer has a third band gap between the first band gap and the second band gap.

2. The light-emitting device according to claim 1 , further comprising a first contact layer on the first light-emitting semiconductor stack, wherein the first contact layer and the reflector are of the same conductivity type.

3. The light-emitting device according to claim 1 , further comprising an etching stop layer between the first current spreading layer and the second light-emitting semiconductor stack.

4. The light-emitting device according to claim 1 , wherein the reflector has a higher reflectivity to the first wavelength than that to the second wavelength.

5. The light-emitting device according to claim 1 , wherein the protecting layer has a thickness between 50 nm and 100 nm both inclusive.

6. The light-emitting device according to claim 1 , wherein the protecting layer has a doping concentration between 1×10 17 /cm 3 and 1×10 19 /cm 3 both inclusive.

7. The light-emitting device according to claim 1 , wherein the protecting layer comprises InGaP and is substantially devoid of Al.

8. The light-emitting device according to claim 2 , further comprising an etching stop layer between the first contact layer and the protecting layer.

9. The light-emitting device according to claim 8 , wherein the etching stop layer has a thickness between 50 nm and 100 nm both inclusive.

10. The light-emitting device according to claim 1 , wherein the protecting layer has a thickness less than 1 um.

11. The light-emitting device according to claim 10 , wherein the protecting layer has a doping concentration between 1×10 17 /cm 3 and 1×10 19 /cm 3 .

12. A light-emitting device, comprising:

a first light-emitting semiconductor stack comprising a first active layer having a first transverse width;

a second light-emitting semiconductor stack below the first light-emitting semiconductor stack, wherein the second light-emitting semiconductor stack comprises a second active layer;

a reflector between the first light-emitting semiconductor stack and the second light-emitting semiconductor stack;

an etching stop layer between the reflector and the second light-emitting semiconductor stack, wherein the etching stop layer has a second transverse width; and

a first contact layer between the etching stop layer and the second light-emitting semiconductor stack, wherein the first contact layer has a third transverse width,

wherein the first active layer emits a first radiation of a first wavelength and the second active layer emits a second radiation of a second wavelength longer than the first wavelength, and

wherein the third transverse width is greater than the second transverse width.

13. The light-emitting device according to claim 12 , wherein the etching stop layer has a thickness between 50 nm and 100 nm both inclusive.

14. The light-emitting device according to claim 12 , wherein the etching stop layer and the first contact layer are of the same conductivity type.

15. The light-emitting device according to claim 12 , wherein the etching stop layer has a doping concentration between 1×10 17 /cm 3 and 1×10 19 /cm 3 both inclusive.

16. The light-emitting device according to claim 12 , wherein the reflector has a fourth transverse width less than the third transverse width.

17. The light-emitting device according to claim 12 , wherein the first transverse width is substantially the same as the second transverse width.

18. The light-emitting device according to claim 12 , wherein the light-emitting device further comprises a first electrode on the second light-emitting semiconductor stack, a second electrode below the second light-emitting semiconductor stack, and a third electrode on the first light-emitting semiconductor stack.

19. A light-emitting module comprising:

a submount; and

a light-emitting device of claim 12 disposed on the submount.