ENERGY STORAGE DEVICE WITH WRAPAROUND ENCAPSULATION
Approaches herein provide encapsulation of a micro battery cell of a cell matrix. The micro battery cell includes an active device, such as a thin film device, formed atop a first side of a substrate. An encapsulant may be formed over the active device, wherein the encapsulant adheres to the active device and to a second side of the substrate. In some approaches, the encapsulant penetrates a plurality of openings provided through the substrate, thus allowing the encapsulant to form along the second side of the substrate to fully envelope the micro battery cell.
1 . An energy storage device comprising:
a thin film device formed on a first side of a substrate; and
an encapsulant formed over the thin film device, wherein the encapsulant covers the thin film device and a second side of the substrate.
2 . The energy storage device of claim 1 , wherein the encapsulant is formed along the first side of the substrate.
3 . The energy storage device of claim 1 , wherein the encapsulant comprises a plurality of encapsulation layers.
4 . The energy storage device of claim 3 , wherein a first layer of the plurality of encapsulation layers is formed over the thin film device and terminates along the first side of the substrate, and wherein a second layer of the plurality of encapsulation layers is formed over the first layer of the plurality of encapsulation layers and extends along the second side of the substrate.
5 . The energy storage device of claim 4 , wherein the second layer is one of: a parylene polymer layer, and a dielectric layer.
6 . The energy storage device of claim 1 , further comprising a second thin film device formed on the second side of the substrate, wherein the encapsulant covers the second thin film device.
7 . A micro battery cell, the micro battery cell comprising:
an active device coupled to a first side of a substrate; and
an encapsulant formed over the active device, wherein the encapsulant adheres to the active device and to a second side of the substrate.
8 . The micro battery cell of claim 7 , further comprising a second active device coupled to the second side of the substrate, wherein the encapsulant adheres to the second active device.
9 . The micro battery cell of claim 7 , wherein the encapsulant is a thin film encapsulant comprising a plurality of encapsulation layers, wherein a first layer of the plurality of encapsulation layers is formed over the active device and terminates along the first side of the substrate, and wherein a second layer of the plurality of encapsulation layers is formed over the first layer of the plurality of encapsulation layers and extends along the second side of the substrate.
10 . The micro battery cell of claim 9 , wherein the second layer is one of: a parylene polymer layer, and a dielectric layer.
11 . The micro battery cell of claim 7 , further comprising a plurality of openings formed through the substrate, wherein the encapsulant is formed through the plurality of openings.
12 . The micro battery cell of claim 11 , wherein the substrate comprises a plurality of corner sections extending outwardly from the active device, wherein the plurality of openings extend between the plurality of corner sections.
13 . The micro battery cell of claim 11 , wherein the plurality of openings are formed along an outer perimeter of the micro battery cell.
14 . A method of forming an energy storage device, comprising:
providing a thin film device on a first side of a substrate;
forming a plurality of openings through the substrate; and
forming a thin film encapsulant over the thin film device, wherein the thin film encapsulant is formed along a surface defining one or more of the plurality of openings, and wherein the thin film encapsulant adheres to the thin film device and covers a second side of the substrate.
15 . The method of claim 14 , further comprising:
forming a first layer of the thin film encapsulant over the thin film device, wherein the first layer of the thin film encapsulant terminates along the first side of the substrate; and
forming a second layer of the thin film encapsulant over the first layer of the thin film encapsulant, wherein the second layer of the thin film encapsulant extends along the second side of the substrate.
16 . The method of claim 14 , further comprising providing a second thin film device on the second side of the substrate, wherein the thin film encapsulant is formed over and adheres to the second thin film device.
17 . The method of claim 14 , further comprising forming the thin film encapsulant using one of: vapor deposition, and liquid coating.
18 . The method of claim 14 , further comprising forming the plurality of openings through the substrate after the thin film device is formed atop the substrate.
19 . The method of claim 14 , further comprising forming the plurality of openings adjacent a side of the thin film device.
20 . The method of claim 14 , further comprising providing a plurality of corner sections of the substrate extending outwardly from the thin film device, wherein the plurality of openings extend between the plurality of corner sections.