Integrated circuit module and method of forming same
View Patent ↗Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
1. An integrated circuit module, comprising:
a first die comprising an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate; and
a second die comprising a first major surface, a second major surface, and a conductive pad disposed on the second major surface of the second die, wherein the second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
2. The module of claim 1 , wherein the second die is disposed completely within the cavity.
3. The module of claim 1 , wherein the first die is fabricated via a first type of fabrication process, and further wherein the second die is fabricated via a second type of fabrication process different from the first type of fabrication process.
4. The module of claim 1 , wherein the first die comprises a digital signal processor die.
5. The module of claim 1 , wherein the second die comprises an integrated passive device die.
6. The module of claim 1 , wherein the second die comprises a memory die.
7. The module of claim 1 , further comprising a nonconductive material disposed between the first major surface of the second die and the cavity.
8. The module of claim 7 , wherein the nonconductive material comprises an adhesive.
9. The module of claim 1 , further comprising a nonconductive material disposed on the second major surface of the second die.
10. The module of claim 1 , further comprising a nonconductive material disposed on at least a portion of the integrated circuit and the first major surface of the active substrate of the first die.
11. The module of claim 1 , wherein the first die further comprises a redistribution layer disposed on the integrated circuit.
12. The module of claim 1 , further comprising a third die disposed at least partially within the cavity.
13. A hearing assistance device, comprising:
a flexible circuit substrate; and
an integrated circuit module disposed within the flexible circuit substrate, wherein the integrated circuit module comprises:
a first die comprising an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate; and
a second die comprising a first major surface, a second major surface, and a conductive pad disposed on the second major surface of the second die, wherein the second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
14. The hearing assistance device of claim 13 wherein the flexible circuit substrate comprises a surface mount component disposed on a first major surface of the flexible circuit substrate and a solder pad connection disposed on a second major surface of the flexible circuit substrate.
15. The hearing assistance device of claim 13 , wherein the flexible circuit substrate comprises a plurality of layers.