Compliant needle for direct transfer of semiconductor devices

1. An apparatus configured to transfer an electrically-actuatable element directly from a first side of a wafer tape to a product substrate having a circuit trace thereon, the apparatus comprising:

a needle disposed adjacent a second side of the wafer tape opposite the first side of the wafer tape;

a needle actuator to move the needle to a position at which the needle presses on the second side of the wafer tape to press the electrically-actuatable element into contact with the circuit trace disposed adjacent the first side of the wafer tape; and

a dampener arranged with an end of the needle and an end of the needle actuator, the dampener dampening a force applied to the electrically-actuatable element when the needle presses the electrically-actuatable element into contact with the circuit trace.

2. The apparatus according to claim 1 , further comprising a clamp connected to the end of the needle actuator and slideably housing the end of the needle.

3. The apparatus according to claim 2 , wherein the clamp comprises a chuck.

4. The apparatus according to claim 1 , wherein the dampener is arranged between the end of the needle actuator and the end of the needle such that when the needle presses the electrically-actuatable element into contact with the circuit trace the dampener is compressed between the end of the needle actuator and the end of the needle.

5. The apparatus according to claim 1 , wherein the dampener comprises a spring, a coil spring, an elastomer, a pneumatic shock absorber, a hydraulic shock absorber.

6. The apparatus according to claim 1 , wherein the end of the needle comprises a flared bore.

7. The apparatus according to claim 6 , further comprising at least a portion of a fiber optic line received by the flared bore,

wherein the flared bore prevents the portion of the fiber optic line received by the flared bore from bending.

8. The apparatus according to claim 1 , wherein the electrically-actuatable element is an unpackaged LED.

9. An apparatus comprising:

a first frame configured to hold a wafer tape having a first side and a second side, a semiconductor device die being disposed on the first side of the wafer tape;

a second frame configured to hold a product substrate having a circuit trace thereon, the second frame to hold the product substrate such that the product substrate is disposed facing the semiconductor device die on the wafer tape;

a needle disposed adjacent the first frame;

a needle actuator connected to the needle to move the needle to a die transfer position at which the needle presses on the second side of the wafer tape to press the semiconductor device die into contact with the circuit trace; and

a dampener arranged with the needle and the needle actuator, the dampener dampening a force applied to the semiconductor device die when the needle presses the semiconductor device die into contact with the circuit trace.

10. The apparatus according to claim 9 , further comprising a chuck connected to an end of the needle actuator and slideably housing an end of the needle.

11. The apparatus according to claim 10 , wherein the dampener is arranged between the end of the needle actuator and the end of the needle such that when the needle presses the semiconductor device die into contact with the circuit trace the dampener is compressed between the end of the needle actuator and the end of the needle.

12. The apparatus according to claim 9 , wherein the end of the needle comprises a flared bore.

13. The apparatus according to claim 9 , wherein the semiconductor device die includes an LED.

14. An apparatus comprising:

a needle having a first end opposite a second end;

a needle actuator to move the needle to a position at which the second end of the needle presses an electrically-actuatable element into contact with a circuit trace; and

a dampener arranged with the first end of the needle and an end of the needle actuator, the dampener dampening a force applied to the electrically-actuatable element when the second end of the needle presses the electrically-actuatable element into contact with the circuit trace.

15. The apparatus according to claim 14 , wherein the dampener is arranged between the end of the needle actuator and the first end of the needle such that when the needle presses the electrically-actuatable element into contact with the circuit trace the dampener is compressed between the end of the needle actuator and the first end of the needle.

16. The apparatus according to claim 14 , further comprising a clamp connected to the end of the needle actuator and slideably housing the first end of the needle.

17. The apparatus according to claim 16 , wherein the clamp comprises a chuck having a set screw to adjust a preload of the dampener.

18. The apparatus according to claim 17 , wherein the chuck includes threads and engages the needle actuator via the threads, and the set screw abuts the needle actuator to prevent the needle actuator from moving relative to the chuck.

19. The apparatus according to claim 14 , wherein the first end of the needle comprises a flared bore.

20. The apparatus according to claim 19 , wherein the dampener comprises a coil spring, and the coil spring abuts the flared bore of the needle and abuts the end of the needle actuator.