III-nitride field-effect transistor with dual gates
A field effect transistor (FET) includes a III-nitride channel layer, a III-nitride barrier layer on the channel layer, a first dielectric on the barrier layer, a first gate trench extending through the first dielectric, and partially or entirely through the barrier layer, a second dielectric on a bottom and walls of the first gate trench, a source electrode on a first side of the first gate trench, a drain electrode on a second side of the first gate trench opposite the first side, a first gate electrode on the second dielectric and filling the first gate trench, a third dielectric between the first gate trench and the drain electrode, a second gate trench extending through the third dielectric and laterally located between the first gate trench and the drain electrode, and a second gate electrode filling the second gate trench.
1. A field-effect transistor comprising:
a III-nitride channel layer;
a III-nitride barrier layer on the channel layer;
a first dielectric layer on the barrier layer;
a first gate trench extending through the first dielectric layer and through the barrier layer;
a second dielectric layer on the first dielectric layer and on a bottom and walls of the first gate trench;
a first gate electrode in the first gate trench and on the second dielectric layer;
a source electrode having electrical contact to the channel layer on a first side of the first gate trench;
a drain electrode having electrical contact to the channel layer on a second side of the first gate trench opposite the first side;
a third dielectric layer on the second dielectric layer, wherein the third dielectric layer entirely covers the first gate electrode;
a second gate trench extending through the third dielectric layer and laterally located between the first gate trench and the drain electrode; and
a second gate electrode in the second gate trench, wherein a bottom of the second gate electrode is between a top surface of the first dielectric layer and a top surface of the second dielectric layer, and wherein the third dielectric layer does not entirely cover the second gate electrode;
wherein walls of the second gate trench are substantially vertical;
wherein the first gate electrode is a normally-off gate; and
wherein the second gate electrode is a normally-on gate.
2. The field-effect transistor of claim 1 wherein a vertical distance between a bottom of the second gate electrode and a top surface of the barrier layer has a range of 1 nm to 100 nm.
3. The field-effect transistor of claim 1 wherein the second dielectric layer comprises at least one layer of AlN.
4. The field-effect transistor of claim 1 wherein the first dielectric layer comprises SiN.
5. The field-effect transistor of claim 1 wherein the third dielectric layer comprises SiN having a thickness of 0.1 nm to 10 μm.
6. The field-effect transistor of claim 1 wherein a threshold voltage of the second gate electrode has a range of less than or equal to 0 volts to greater than or equal to −50 volts.
7. The field-effect transistor of claim 1 further comprising:
an electrical connection between the second gate electrode and the source electrode.
8. The field-effect transistor of claim 1 further comprising:
an electrical connection between the second gate electrode and the first gate electrode.
9. The field-effect transistor of claim 1 further comprising:
a substrate comprising Si, Sapphire, SiC, GaN or AlN; and
a III-nitride buffer layer coupled between the substrate and the channel layer.
10. The field-effect transistor of claim 1 wherein the III-nitride barrier layer comprises AlGaN having a thickness of 1 nanometer (nm) to 20 nm.
11. The field-effect transistor of claim 1 wherein the second gate electrode has a bias voltage different than a bias voltage for the first gate electrode.
12. A field-effect transistor comprising:
a III-nitride channel layer;
a III-nitride barrier layer on the channel layer;
a first dielectric layer on the barrier layer;
a source electrode disposed on a first end of the field effect transistor;
a drain electrode disposed on a second end of the field effect transistor opposite the first end;
a first gate structure disposed between the source electrode and the drain electrode, the first gate structure extending through the barrier layer;
a second gate structure disposed between the first gate structure and the drain electrode; and
a second dielectric layer on the first dielectric layer, the second dielectric layer covering the first gate structure;
wherein the second gate structure is on the first dielectric layer and extends through the second dielectric layer;
wherein the first gate structure is a normally-off gate; and
wherein the second gate structure is a normally-on gate.
13. The field effect transistor of claim 12 wherein the first gate structure comprises:
a first gate trench extending through the first dielectric layer, and through the barrier layer;
a third dielectric on a bottom and walls of the first gate trench; and
a first gate electrode on the second dielectric and filling the first gate trench.
14. The field effect transistor of claim 12 wherein the second gate structure comprises:
a second gate trench extending through the second dielectic layer; and
a second gate electrode filling the second gate trench.