Semiconductor memory device and method for manufacturing the same
A semiconductor memory device includes a connecting member including a semiconductor material, a first electrode film, a first insulating film, a stacked body and three or more semiconductor pillars. The stacked body includes second electrode films and second insulating films that alternately stacked. The semiconductor pillars are arrayed along two or more directions, extend in a stacking direction, pierce through the stacked body and the first insulating film, and are connected to the connecting member. The device includes a third insulating film provided between the semiconductor pillars and the stacked body and between the connecting member and the first electrode film. A charge storage layer is provided at least between one of the second electrode films and the third insulating film.
1. A semiconductor memory device comprising:
a connecting member having a through hole;
a first insulating film provided on the connecting member;
a stacked body provided on the first insulating film, the stacked body including electrode films and second insulating films, each of the electrode films and each of the second insulating films being alternately stacked;
a semiconductor pillar extending in a stacking direction of the electrode films and the second insulating films, piercing through the stacked body and the first insulating film, the semiconductor pillar being electrically connected to the connecting member;
a third insulating film provided between the semiconductor pillar and the stacked body; and
a support portion disposed in the through-hole of the connecting member.
2. The device according to claim 1 , further comprising:
a first support film provided above the connecting member; and
a second support film provided under the connecting member,
wherein the through-hole extends in the stacking direction.
3. The device according to claim 2 , wherein the support portion, the first support film and the second support film are monolithically formed.
4. The device according to claim 1 , wherein the semiconductor pillar overlaps with the through-hole as viewed from the stacking direction.
5. The device according to claim 1 , further comprising an electrode member extending in the stacking direction, piercing through the stacked body and the first insulating film, and connected to the connecting member.
6. The device according to claim 1 , wherein the third insulating film is also provided on a lower surface of the semiconductor pillar.
7. The device according to claim 1 , wherein the third insulating film includes a silicon oxide layer and a silicon nitride layer.
8. A semiconductor memory device comprising:
a connecting member having a through hole;
a first insulating film provided on the connecting member;
a stacked body provided on the first insulating film, the stacked body including electrode films and second insulating films, each of the electrode films and each of the second insulating films being alternately stacked;
a semiconductor pillar extending in a stacking direction of the electrode films and the second insulating films, and piercing through the stacked body and the first insulating film;
a third insulating film provided between the semiconductor pillar and the stacked body; and
a support portion disposed in the through-hole of the connecting member,
wherein the semiconductor pillar pierces through the connecting member.
9. A semiconductor memory device comprising:
a connecting member having a through hole;
a first insulating film provided on the connecting member;
a support portion disposed in the through-hole of the connecting member;
a stacked body provided on the first insulating film, the stacked body including electrode films and second insulating films, each of the electrode films and each of the second insulating films being alternately stacked;
a semiconductor pillar extending in a stacking direction of the electrode films and the second insulating films, piercing through the stacked body and the first insulating film, and electrically connected to the connecting member; and
a third insulating film provided between the semiconductor pillar and the stacked body and provided on a lower surface of the semiconductor pillar.
10. The device according to claim 9 , wherein the third insulating film includes a silicon oxide layer and a silicon nitride layer.
11. The device according to claim 9 , wherein the through-hole extends in the stacking direction.
12. The device according to claim 11 , further comprising:
a first support film provided above the connecting member; and
a second support film provided under the connecting member,
wherein the support portion, the first support film and the second support film are monolithically formed.
13. The device according to claim 9 , wherein the semiconductor pillar overlaps with the through-hole as viewed from the stacking direction.
14. The device according to claim 9 , further comprising an electrode member extending in the stacking direction, piercing through the stacked body and the first insulating film, and connected to the connecting member.
15. The device according to claim 9 , wherein the semiconductor pillar pierces through the connecting member.