System and Method of Crosstalk Mitigation in Microstrip Serial Links in a Printed Circuit Board
A printed circuit board includes a core layer having a thickness (H) and a microstrip trace pair on a top surface of the core layer. The microstrip trace pair communicates serial data at a data transfer rate. A separation (S1) between a first trace of the microstrip trace pair and a second trace of the microstrip trace pair is defined as S 1 =XH, where X is less than or equal to 5. The data transfer rate is greater than or equal to 16 gigabits per second (Gbps).
1 . A printed circuit board, comprising:
a core layer having a thickness (H); and
a first microstrip trace pair on a top surface of the core layer, the first microstrip trace pair to communicate first serial data at a data transfer rate, wherein a first separation (S1) between a first trace of the first microstrip trace pair and a second trace of the first microstrip trace pair is defined as S 1 =XH, where X is less than or equal to 5, and the data transfer rate is greater than or equal to 16 gigabits per second (Gbps).
2 . The printed circuit board of claim 1 , further comprising:
a second microstrip trace pair on the top surface of the core layer, the second microstrip trace pair to communicate second serial data at the data transfer rate, wherein a second trace separation between a first trace of the second microstrip trace pair and a second trace of the second microstrip trace pair is equal to S 1 , and a third trace separation (S 2 ) between the first trace of the first microstrip trace pair and the first trace of the second microstrip trace pair is defined as S 2 =YH, where Y is less than or equal to 10.
3 . The printed circuit board of claim 2 , wherein Y is equal to 5.
4 . The printed circuit board of claim 3 , wherein H is equal to 3 mils or more.
5 . The printed circuit board of claim 3 , wherein the data transfer rate is greater than or equal to 25 Gbps, X is equal to 0.5, and H is greater than or equal to 6 mils.
6 . The printed circuit board of claim 5 , wherein the data transfer rate is 32 Gbps.
7 . The printed circuit board of claim 2 , wherein Y is equal to 10.
8 . The printed circuit board of claim 7 , wherein H is greater than or equal to 3 mils.
9 . The printed circuit board of claim 7 , wherein the data transfer rate is 25 Gbps or higher, and X is less than or equal to 2.0.
10 . The printed circuit board of claim 9 , wherein the data transfer rate is 32 Gbps, X is equal to 0.5, and H is greater than or equal to 6 mils.
11 . A method comprising:
providing a core layer of a printed circuit board, the core layer having a thickness (H); and
providing a first microstrip trace pair on a top surface of the core layer, the first microstrip trace pair to communicate first serial data at a data transfer rate, wherein a first separation (S1) between a first trace of the first microstrip trace pair and a second trace of the first microstrip trace pair is defined as S 1 =XH, where X is less than or equal to 5, and the data transfer rate is greater than or equal to 16 gigabits per second (Gbps).
12 . The method of claim 11 , further comprising:
providing a second microstrip trace pair on the top surface of the core layer, the second microstrip trace pair to communicate second serial data at the data transfer rate, wherein a second trace separation between a first trace of the second microstrip trace pair and a second trace of the second microstrip trace pair is equal to S 1 , and a third trace separation (S 2 ) between the first trace of the first microstrip trace pair and the first trace of the second microstrip trace pair is defined as S 2 =YH, where Y is less than or equal to 10.
13 . The method of claim 12 , wherein Y is equal to 5.
14 . The method of claim 13 , wherein H is equal to 3 mils or more.
15 . The method of claim 13 , wherein the data transfer rate is greater than or equal to 25 Gbps, X is equal to 0.5, and H is greater than or equal to 6 mils.
16 . The method of claim 12 , wherein Y is equal to 10.
17 . The method of claim 16 , wherein H is greater than or equal to 3 mils.
18 . The method of claim 16 , wherein the data transfer rate is 25 Gbps or higher, and X is less than or equal to 2.0.
19 . The method of claim 18 , wherein the data transfer rate is 32 Gbps, X is equal to 0.5, and H is greater than or equal to 6 mils.
20 . A non-transitory computer readable medium including code for performing a method, the method comprising:
providing a core layer of a printed circuit board, the core layer having a thickness (H); and
providing a first microstrip trace pair on a top surface of the core layer, the first microstrip trace pair to communicate first serial data at a data transfer rate, wherein a first separation (S1) between a first trace of the first microstrip trace pair and a second trace of the first microstrip trace pair is defined as S 1 =XH, where X is less than or equal to 5, and the data transfer rate is greater than or equal to 16 gigabits per second (Gbps).