IP Library Granted Patent US 10,820,450
Granted Patent B2
US 10,820,450 · App. 15/351,362 · Granted Oct 27, 2020

Modular heat-transfer systems

Inventors: Geoff Sean Lyon (Calgary, CA); Mike Holden (Calgary, CA); Brydon Gierl (Calgary, CA)
Assignee: CoolIT Systems, Inc.
H05K7/20781H01L23/473H01L2924/0002H05K7/20218H05K7/20272H05K7/20627H05K7/20763
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Quick Facts
Patent No.
US 10,820,450
App. No.
15/351,362
Granted
Oct 27, 2020
Kind
B2
Abstract

Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

Claims (23)

1. A modular cooling system comprising:

a liquid-liquid heat exchanger defining a first flow path and a second flow path, wherein the first flow path and the second flow path are thermally coupled with each other and fluidly isolated from each other, wherein the first flow path has a corresponding inlet and a corresponding outlet;

a closed liquid circuit configured to circulate a liquid, the closed liquid circuit comprising

a plurality of heat-transfer elements, wherein each heat-transfer element has a component heat-exchange module, wherein each component heat-exchange module has an integrated pump and heat-sink, wherein each respective heat-sink is configured to conductively receive heat from a corresponding electronic component and to transfer the received heat to the liquid in the respective component heat-exchange module;

a distribution manifold fluidly coupling the outlet from the first flow path through the liquid-liquid heat exchanger with each respective heat-transfer element; and

a collection manifold fluidly coupling the inlet to the first flow path through the liquid-liquid heat exchanger with each respective heat-transfer element, wherein the integrated pumps of the component heat-exchange modules are the only pumps in the closed liquid circuit configured to urge the liquid to circulate through the closed liquid circuit.

2. A modular cooling system according to claim 1 , further comprising a rack configured to receive a plurality of independently operable servers, each having a corresponding one or more of the plurality of heat-transfer elements.

3. A modular cooling system according to claim 2 , wherein the rack is further configured to mountably receive one or more of the liquid-liquid heat exchanger, the distribution manifold, and the collection manifold.

4. A modular cooling system according to claim 1 , further comprising a sensor configured to emit a signal corresponding to a leak of liquid from the liquid-liquid heat exchanger, the closed liquid circuit, or both.

5. A modular cooling system according to claim 4 , further comprising a control apparatus configured to limit a flow of liquid through the first flow path, the second flow path, or both, at least partially responsively to the signal emitted by the sensor.

6. A modular cooling system according to claim 1 , further comprising a sensor configured to detect a leak of liquid from the liquid-liquid heat exchanger, the closed liquid circuit, or both.

7. A modular cooling system according to claim 1 , further comprising a chassis to mountably receive a plurality of servers, each server having mounted therein or thereon one or more of the plurality of heat-transfer elements, wherein the chassis mountably supports the liquid-liquid heat exchanger, the distribution manifold, and the collection manifold.

8. A modular cooling system according to claim 1 , further comprising:

a sensor configured to monitor a condition of the first fluid circuit; and

a controller configured to adjust one or more operating parameters of the modular cooling system at least partially responsively to a signal emitted by the sensor.

9. A modular cooling system according to claim 8 , further comprising one or more valves actuatable by the controller, wherein the one or more valves is configured to control a respective flow rate of the first working fluid, the second working fluid, or both, respectively.

10. A modular cooling system according to claim 8 , wherein the controller is configured to emit a signal related to a sensed condition indicative of an operational state of the cooling system.

11. A modular cooling system according to claim 8 , wherein the sensor is a humidity sensor configured to measure a humidity of ambient air adjacent the liquid-liquid heat-exchanger.

12. A modular cooling system according to claim 11 , further comprising:

one or more actuatable valves, wherein the controller comprises

a processor; and

a memory containing instructions that, when executed by the processor, cause the processor to determine a dew point temperature at least partially based on the humidity of ambient air measured by the humidity sensor, wherein the one or more operating parameters comprises an actuation state of at least one of the one or more actuatable valves, wherein the controller is configured to actuate at least one of the one or more actuatable valves at least partially responsively to the dew point temperature determined by the processor being less than a threshold difference from a temperature of a surface of the modular cooling system.

13. A modular cooling system according to claim 12 , wherein the threshold difference is selected to prevent condensation from forming on the surface of the modular cooling system.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Jul 2, 2026
From: ATB FINANCIAL
To: COOLIT SYSTEMS INC.
Reel/Frame 075164/0029 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2022
From: KLINE HILL PARTNERS FUND II LP
To: COOLIT SYSTEMS INC.
Reel/Frame 059381/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2022
From: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC.
To: COOLIT SYSTEMS INC.
Reel/Frame 059381/0126 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2022
From: COMERICA BANK
To: COOLIT SYSTEMS INC.
Reel/Frame 059380/0518 →
SECURITY INTEREST Recorded Dec 23, 2020
From: COOLIT SYSTEMS INC.
To: ATB FINANCIAL
Reel/Frame 054739/0750 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2020
From: LYON, GEOFF SEAN; HOLDEN, MIKE; GIERL, BRYDON
To: COOLIT SYSTEMS, INC.
Reel/Frame 052843/0959 →
SECURITY INTEREST Recorded Jun 3, 2020
From: COOLIT SYSTEMS INC
To: KLINE HILL PARTNERS FUND II LP
Reel/Frame 052820/0146 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS FOR THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 047264 FRAME 0570. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE ADDRESS IS: SUITE 680, 1285 WEST BROADWAY,VANCOUVER, BRITISH COLUMBIA, CANADA V6H 3X8. Recorded Oct 25, 2018
From: COOLIT SYSTEMS INC.
To: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC.
Reel/Frame 047312/0966 →
SECURITY INTEREST Recorded Oct 22, 2018
From: COOLIT SYSTEMS INC.
To: VISTARA TECHNOLOGY GROWTH FUND III LIMITED PARTNERSHIP, BY ITS GENERAL PARTNER, VISTARA GENERAL PARTNER III INC.
Reel/Frame 047264/0570 →
SECURITY INTEREST Recorded Apr 14, 2017
From: COOLIT SYSTEMS INC.
To: COMERICA BANK
Reel/Frame 042007/0501 →
Continuity (6)
Continuation 13559340 · Jul 26, 2012
Continuation In Part 13401618 · Feb 21, 2012
Provisional Application 61622982 · Apr 11, 2012
Provisional Application 61522247 · Aug 11, 2011
Provisional Application 61512379 · Jul 27, 2011
Related Publication 20170064874A1 · Mar 2, 2017
Cited By (5)
US 12,188,733 US 12,460,878 US 12,495,513 US 12,520,452 US 12,610,501