Disinfectant material comprising a copper halide salt and surfactant
A disinfectant material may be used to kill bacteria, viruses, mold and fungal contaminants while minimizing toxic risks to humans. The disinfectant material may be effective in killing pathogens and more on numerous types of surfaces including on the skin of mammals. Exemplary embodiments include a copper halogen, such as copper iodide. Exemplary materials may also include a pH stabilizer, a preservative, humectants, or other constituents. Exemplary disinfectant materials may be used as a liquid or a gel, applied via a wipe, sprayed or in other forms.
1. An anti-microbial material disinfectant solution comprising:
(a) an anti-microbial copper composition having:
nanoparticles of copper halide salt that are able to produce copper ions,
wherein the copper ions are in a form of cuprous ions,
wherein the cuprous ions transform into cupric ions in the presence of a microbial,
wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
wherein the cupric ions reverse back catalytically to cuprous ions in the presence of a halogen, and
wherein the surface of the copper composition particles are hydrophobic;
(b) a polar solvent that comprising water or alcohol forming a water or alcohol based solution,
wherein the copper composition has a concentration of 5 to 500 mg per liter of the solution; and
(c) an anionic surfactant with an alkyl non-polar tail,
wherein the copper composition particles interact with the anionic surfactant and the non-polar tail of the surfactant is attracted to the hydrophobic surface of the copper composition particles, and
wherein the anionic surfactant is provided in the solution at a concentration of 0.1% to 0.5%;
(d) Polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume;
wherein the polar solvent, anionic surfactant, and copper composition particles come together to form a complex that traps the polar solvent in the immediate surrounding volume of the copper composition particles.
2. The anti-microbial material disinfectant solution of claim 1 ,
wherein the copper composition is provided in a concentration of 20 mg per liter of the solution.
3. The anti-microbial material of disinfectant solution claim 1 ,
wherein as a result of the transformation of cuprous ions to cupric ions by a Fenton-type reaction, hydroxyl radicals are created.
4. The anti-microbial material disinfectant solution of claim 1 ,
wherein the copper composition has anti-fungal activity.
5. The anti-microbial material disinfectant solution of claim 1 ,
wherein the copper composition has antibacterial activity,
wherein the antibacterial activity occurs with respect to Gram Positive and Gram Negative bacteria.
6. The anti-microbial material disinfectant solution of claim 1 ,
wherein the copper composition has antiviral activity,
wherein the antiviral activity occurs with respect to enveloped and non-enveloped viruses.
7. The anti-microbial material disinfectant solution of claim 1 ,
wherein the copper composition, combined with the one anionic surfactant in the presence of the polar solvent forms a nanofilm layer on positively and negatively charged surfaces.
8. The anti-microbial material disinfectant solution of claim 7 , wherein the polar solvent is water.
9. The anti-microbial material disinfectant solution of claim 1 , wherein the particle size of the copper halide salt is between 50-5000 nm.
10. The anti-microbial material disinfectant solution of claim 1 , wherein the Polyphenylsilsesquioxane is between 0.1%-20% of the solution by volume.
11. The anti-microbial material disinfectant solution of claim 1 wherein the copper halide salt is not in a complex with benzoic acid or a benzoic acid analog.
12. The anti-microbial material disinfectant solution of claim 1 wherein the material does not include benzoic acid or a benzoic acid analog.
13. An anti-microbial material disinfectant solution comprising:
(a) nanoparticles including copper and a halogen, the particles being operable to produce copper ions,
wherein the copper ions are in a form of cuprous ions,
wherein the cuprous ions transform into cupric ions in the presence of a microbial,
wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
wherein the cupric ions reverse back catalytically to cuprous ions in the presence of the halogen; and
(b) a polar solvent comprising alcohol or water forming a solution, wherein the copper composition has a concentration of 5 to 500 mg of the copper composition per liter of the solution; and
(c) a surfactant operable to facilitate cohesion of the material to a surface, the surfactant provided in the solution at a concentration of 0.1% to 0.5% and operable to form a complex that traps the solution in the immediate surrounding volume of the particles;
(d) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume:
wherein the disinfectant solution is operable to form a nanofilm layer on positively and negatively charged surfaces.
14. The anti-microbial material of claim 13 , wherein the copper and the halogen are provided as at least one copper halide salt.
15. The anti-microbial material of claim 14 , wherein the particle size of the copper halide salt is between 50-5000 nm.
16. An anti-microbial material comprising,
an anti-microbial copper composition, including particles that are able to produce copper ions,
wherein the copper ions are in a form of cuprous ions,
wherein the cuprous ions may be transformed into cupric ions,
wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
wherein the cupric ions may reverse back catalytically to cuprous ions
and an alcohol based solution,
wherein the solution comprises 3-methoxy-3-methyl-1-butanol in an amount between 80% and 99.9% of the solution by weight,
wherein the copper composition has limited solubility in the solution,
wherein the limited solubility is below 50 mg of the copper composition per liter of the solution.
17. An anti-microbial material disinfectant solution comprising:
(a) copper iodide salt particles operable to produce copper ions,
wherein the copper ions are in a form of cuprous ions, wherein the cuprous ions transform into cupric ions,
wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction,
and wherein the cupric ions reverse back catalytically to cuprous ions;
(b) a water or alcohol based solution, wherein the copper iodide salt has a concentration of 5 to 500 mg of the copper iodide salt per liter of the solution;
(c) at least one surfactant operable to facilitate cohesion of the material to a surface, wherein the surfactant is provided in the solution at a concentration of 0.1% to 0.5%; and
(d) at least one member selected from the group consisting of a pH stabilizer; a preservative, a rheology agent, chelating agent, a humectant, and combinations thereof;
(e) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume;
wherein the material is operable to form a nanofilm layer on positively and negatively charged surfaces.
18. A wetted cloth forming a wipe comprising the anti-microbial material disinfectant solution of claim 1 .
19. A liquid solution in a liquid dispenser having an atomizer dispensing element comprising the anti-microbial material disinfectant solution of claim 1 .
20. A liquid gel as a hand sanitizer comprising the anti-microbial material disinfectant solution of claim 1 .
21. The anti-microbial material disinfectant solution of claim 1 , wherein the anionic surfactant is selected from the group consisting of phosphate esters, dioctyl sulfosuccinate, alpha olefin sulfonate, octane sulfonate, ethylhexyl sulfate, lauryl sulfate, laureth sulfate, and combinations thereof.
22. A method of disinfecting a surface, the method comprising:
(a) providing an anti-microbial disinfectant solution having a water or alcohol based comprising:
(i) copper halide salt particles that produce copper ions in a form of cuprous ions, the copper halide salt particles having a concentration of 5 to 500 mg per liter of the solution;
(ii) an anionic surfactant with an alkyl non-polar tail configured to facilitate cohesion of the material to a surface provided in the solution at a concentration of 0.1% to 0.5%; and
(iii) a polar solvent, wherein the polar solvent, anionic surfactant, and copper iodide salt particles come together to form a complex that traps the polar solvent in the immediate surrounding volume of the copper iodide salt particles; and
(iv) polyphenylsilsequioxane at a concentration of 0.1 to 50% of the solution by volume;
(b) applying the antimicrobial disinfectant solution to the surface;
(c) forming a nanolayer of the disinfectant solution on the surface;
(d) exposing the surface to a microbial;
(e) transforming the cuprous ions into cupric ions in the presence of the microbial, wherein the transformation of cuprous ions to cupric ions occurs by a Fenton-type reaction; and
(f) catalytically reversing back the cupric ions to cuprous ions in the presence of the halide.