Biocompatible bonding method and electronics package suitable for implantation
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
1. A method of making an implantable electronic device comprising:
forming a hermetic electronics control unit including a contact,
forming a flexible circuit including a first thin film flexible electrically insulating substrate, an electrically conducting metal layer deposited on the first insulating layer, a second thin film flexible electrically insulating substrate deposited on the electrically conducting metal layer, at least one bond pad defining a through hole entirely through the flexible circuit;
providing weldable material which is electrically conductive and biocompatible;
aligning the weldable material, bond pad, and the contact; and
wielding the weldable material, bond pad and contact together; and
cutting the weldable material.
2. The method according to claim 1 , wherein the weldable material is a wire.
3. The method according to claim 1 , wherein the weldable materials is a ribbon.
4. The method according to claim 1 , wherein the weldable material is a sheet.
5. The method according to claim 1 , wherein the step of welding is by a parallel gap welder.
6. The method according to claim 1 , wherein the weldable materials is a wire, the step of welding is by a parallel gap welder and the parallel gap welder pushes the wire into the through hole.
7. The method according to claim 1 , wherein the weldable material is selected from the group consisting of platinum, alloys of platinum and platinum-iridium.
8. The method according to claim 1 , wherein the weldable material is platinum.
9. The method according to claim 1 , wherein the weldable material is platinum wire.