Shield can

1. A method comprising:

installing a frame on top of a printed circuit board (PCB) by using a cross-bar connected to flanges at tops of opposing sides of the frame to place the frame on the PCB, the cross-bar having a bent shape when the frame is installed such that a lower surface of the cross-bar is raised above the flanges at the tops of the opposing sides of the frame such that the lower surface of the cross-bar does not interfere with components within the frame;

removing the cross-bar from the frame subsequent to installing the frame on the PCB;

installing one or more flexible printed circuits (FPCs) on the PCB after removal of the cross-bar; and

connecting a lid to the frame to form a shield can over the one or more FPCs.

2. A method as recited in claim 1 , wherein installing the frame on the PCB includes:

soldering the frame to the PCB.

3. A method as recited in claim 1 , wherein the cross-bar is removed by snipping or twisting the cross-bar.

4. A method comprising:

installing a frame on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB;

removing the cross-bar from the frame subsequent to installing the frame on the PCB, the removing the cross-bar from the frame causes a burr to be formed on the frame at a previous connection point of the cross-bar to the frame;

installing one or more flexible printed circuits (FPCs) on the PCB after removal of the cross-bar; and

connecting a lid to the frame to form a shield can over the one or more FPCs, the burr being received via a hole in the lid that is aligned with the previous connection point of the cross-bar to the frame.

5. A method as recited in claim 1 , wherein connecting the lid to the frame comprises:

latching one or more protrusions disposed on the lid with one or more corresponding indentations that are disposed on the frame.

6. A method as recited in claim 1 , wherein the shield can is formed to permit at least one of said FPCs to exit the shield can through a gap in the frame.

7. A method as recited in claim 1 , wherein the one or more FPCs are installed within the frame on the PCB.

8. A method as recited in claim 1 , wherein installing the frame on the PCB includes securing the frame to the PCB via adhesive.

9. A method as recited in claim 1 , wherein the lid is connected to the frame via pressure sensitive adhesive (PSA).

10. A method as recited in claim 1 , wherein connecting the lid to the frame comprises:

latching one or more indentations disposed on the lid with one or more corresponding protrusions that are disposed on the frame.

11. A method as recited in claim 1 , wherein the frame is formed from a conductive material.

12. A method as recited in claim 1 , wherein the frame includes a non-conductive inner surface.

13. A method as recited in claim 1 , wherein the one or more FPCs are installed directly on the PCB.

14. A method as recited in claim 1 , wherein the one or more FPCs are installed on one or more of the components that are installed on the PCB.

15. A method as recited in claim 1 , wherein the lid includes dimples along a perimeter of the lid.

16. A method as recited in claim 1 , further comprising:

adhering flanges of the lid to a conductive foam.

17. A method as recited in claim 1 , wherein installing the frame on the PCB includes:

picking up the frame by a pick and place machine using the cross-bar.

18. A method as recited in claim 1 , further comprising:

installing one or more additional components on the PCB after removing the cross-bar.

19. A method as recited in claim 1 , further comprising:

installing shield clips on the PCB; and

pressing the frame into the shield clips.

20. A method as recited in claim 19 , wherein the shield clips include domes.