IP Library Granted Patent US 10,293,467
Granted Patent B2
US 10,293,467 · App. 15/359,019 · Granted May 21, 2019

Positive relief forming of polycrystalline diamond structures and resulting cutting tools

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Quick Facts
Patent No.
US 10,293,467
App. No.
15/359,019
Granted
May 21, 2019
Kind
B2
Abstract

Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Claims (49)

1. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:

forming a mold assembly, the mold assembly including:

a mold having an interior surface at least partially defining a cavity therein and including at least one flute recess extending about 500 μm to about 2 cm into the interior surface of the mold;

a substrate positioned within the cavity, the substrate having a surface; and

diamond particles positioned within the at least one flute recess; and

subjecting the mold assembly to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles and bond at least one PCD portion at least partially formed from the diamond particles to an imperforate portion of the surface of the substrate.

2. The method of claim 1 , further comprising removing mold material from the PCD structure after subjecting the mold assembly to the HPHT process.

3. The method of claim 1 , wherein the at least one flute recess extends generally helically.

4. The method of claim 1 , wherein the cavity includes an end-region recess at a distal end therein, the end-region recess including the at least one flute recess extending therefrom.

5. The method of claim 1 , wherein:

the cavity is a generally cylindrical cavity;

forming a mold assembly includes:

inserting the substrate having a shape complementary to the generally cylindrical cavity into the generally cylindrical cavity such that the surface of the substrate is adjacent to the interior surface of the mold; and

disposing the diamond particles into the at least one flute recess when the substrate is adjacent to the interior surface.

6. The method of claim 5 , wherein forming the mold assembly includes coating the interior surface of the mold, including the at least one flute recess, with a refractory metal material prior to insertion of the substrate and the diamond particles into the generally cylindrical cavity.

7. The method of claim 1 , further comprising removing the substrate having the at least one PCD portion bonded thereto from the mold and at least partially leaching the at least one PCD portion to a depth therein.

8. The method of claim 1 , wherein the diamond particles positioned within the at least one flute recess is at least partially encapsulated in a tube.

9. The method of claim 1 , wherein the cavity includes an end-region recess at a distal end, and the at least one flute recess extends generally helically along the interior surface of the mold to substantially a center point in the end-region recess.

10. The method of claim 1 , further comprising:

removing mold material from around the at least one PCD portion and the substrate; and

processing the at least one PCD portion to a final dimension using at least one of milling, grinding, lapping, electro-discharge machining, or lasing.

11. The method of claim 1 , further comprising forming the mold by at least one of three-dimensional printing the mold at least partially from a refractory metal material, or isostatically pressing a refractory metal material around a positive form to be molded and then removing the positive form.

12. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:

forming a mold assembly, the mold assembly including:

a mold having a cavity therein including at least one flute recess extending generally helically about the cavity;

a substrate positioned within the cavity, the substrate having a surface and at least one debris slot extending generally helically around the substrate and substantially congruent to the at least one flute recess; and

diamond particles positioned within the at least one flute recess and at least partially encapsulated in a tube; and

subjecting the mold assembly to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles and bond at least one PCD portion at least partially formed from the diamond particles to an imperforate portion of the surface of the substrate.

13. The method of claim 12 , wherein the cavity includes an end-region recess at a distal end therein, the end-region recess including the at least one flute recess extending therefrom.

14. The method of claim 12 , wherein:

the cavity is a generally cylindrical cavity;

the mold includes an interior surface at least partially defining the generally cylindrical cavity;

the at least one flute recess is formed in the interior surface of the mold;

forming a mold assembly includes:

inserting the substrate having a shape complementary to the generally cylindrical cavity into the generally cylindrical cavity such that the surface of the substrate is adjacent to the interior surface of the mold; and

disposing the diamond particles into the at least one flute recess when the substrate is adjacent to the interior surface.

15. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:

positioning one or more tubes at least partially encapsulating a plurality of diamond particles in contact with a substrate, wherein the substrate includes at least one lateral surface including one or more non-recessed portions, and the one or more tubes contact the one or more non-recessed portions of the at least one lateral surface; and

subjecting the substrate and the one or more tubes to a high-pressure/high-temperature (“HPHT”) process effective to sinter the plurality of diamond particles to form a PCD flute volume and bond the PCD flute volume to the one or more non-recessed portions of the at least one lateral surface of the substrate.

16. The method of claim 15 , wherein positioning one or more tubes in contact with a substrate includes positioning the one or more tubes helically along at least a portion of the at least one lateral surface of the substrate.

17. The method of claim 15 , wherein the at least one lateral surface includes one or more recessed portions adjacent to the one or more non-recessed portions, and the one or more recessed portions extend substantially parallel to the non-recessed portions.

18. The method of claim 15 , further comprising:

removing mold material from around the PCD flute volume and the substrate;

processing the PCD flute volume to a final dimension using at least one of milling, grinding, lapping, electro-discharge machining, or lasing; and

at least partially leaching the PCD flute volume to a selected depth therein.

19. The method of claim 15 , wherein:

the substrate includes an end surface; and

positioning one or more diamond material tubes in contact with a substrate includes positioning the one or more diamond material tubes in contact with the end surface of the substrate.

20. The method of claim 14 , wherein the at least one flute recess extends about 500 μm to about 2 cm into the interior surface of the mold.

Assignments (4)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →