IP Library Granted Patent US 10,039,200
Granted Patent B2
US 10,039,200 · App. 15/359,172 · Granted Jul 31, 2018

Engagement structure, electronic component module, and electrical connection box

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Quick Facts
Patent No.
US 10,039,200
App. No.
15/359,172
Granted
Jul 31, 2018
Kind
B2
Abstract

An engagement structure includes a block that has first and second side surfaces, and that holds an electronic component; a cover that has first inner wall surfaces facing the first side surfaces and second inner wall surfaces facing the second side surfaces; an engagement mechanism that includes a projecting engagement portion provided on either one of the first side surface and corresponding first inner wall surface and an recessed engagement portion provided in the other thereof; and a projection that is provided on one surface of the second side surface and corresponding second inner wall surface, and that is in contact with the other surface thereof to press the other surface so as to restrain the first side surfaces and the first inner wall surfaces from relatively moving in directions separating from each other in an engaged state of the engagement mechanism.

Claims (19)

1. An engagement structure comprising:

a block that has a first side surface and a second side surface, and that holds an electronic component;

a cover that has a first inner wall surface facing the first side surface, and a second inner wall surface facing the second side surface, and that covers the block and the electronic component in an integrated manner;

an engagement mechanism that includes a projecting engagement portion provided on one of the first side surface and the first inner wall surface and an recessed engagement portion provided in the other of the first side surface and the first inner wall surface, the recessed engagement portion is a through-hole, the projecting engagement portion enters the through-hole, and the porjecting engagement portion includes a projection surface that engages the through-hole; and

a projection that is provided on one surface of the second side surface and the second inner wall surface, and configured to be in contact with the other surface of the second side surface and the second inner wall surface to press the other surface and deform the cover inward such that the first inner wall surface gets close to the first side surface and deformation amount increases from both ends toward a central part in the transverse direction of the first inner wall surface so as to restrain the first side surface and the first inner wall surface from relatively moving in directions separating from each other in an engaged state of the engagement mechanism.

2. The engagement structure according to claim 1 , wherein the second side surface is a surface intersecting the first side surface, and the projection is located at an end on the first side surface side of the second side surface.

3. An electronic component module comprising:

an electronic component;

a block that has a first side surface and a second side surface, and that holds the electronic component;

a cover that has a first inner wall surface facing the first side surface and a second inner wall surface facing the second side surface, and that covers the block and the electronic component in an integrated manner;

an engagement mechanism that includes a projecting engagement portion provided on one of the first side surface and the first inner wall surface and an recessed engagement portion provided in the other of the first side surface and the first inner wall surface, the recessed engagement portion is a through-hole, the projecting engagement portion enters the through-hole, and the projecting engagement portion includes a projection surface that engages the through-hole; and

a projection that is provided on one surface of the second side surface and the second inner wall surface, and configured to be in contact with the other surface of the second side surface and the second inner wall surface to press the other surface and deform the cover inward such that the first inner wall surface gets close to the first side surface and deformation amount increases from both ends toward a central part in the transverse direction of the first inner wall surface so as to restrain the first side surface and the first inner wall surface from relatively moving in directions separating from each other in an engaged state of the engagement mechanism.

4. An electrical connection box comprising:

an electronic component;

a block that has a first side surface and a second side surface, and that holds the electronic component;

a cover that has a first inner wall surface facing the first side surface and a second inner wall surface facing the second side surface, and that covers the block and the electronic component in an integrated manner;

an engagement mechanism that includes a projecting engagement portion provided on one of the first side surface and the first inner wall surface and an recessed engagement portion provided in the other of the first side surface and the first inner wall surface, the recessed engagement portion is a through-hole, the projecting engagement portion enters the through-hole, and the projecting engagement portion includes a projection surface that engages the through-hole;

a projection that is provided on one surface of the second side surface and the second inner wall surface, and configured to be in contact with the other surface of the second side surface and the second inner wall surface to press the other surface and deform the cover inward such that the first inner wall surface gets close to the first side surface and deformation amount increases from both ends toward a central part in the transverse direction of the first inner wall surface so as to restrain the first side surface and the first inner wall surface from relatively moving in directions separating from each other in an engaged state of the engagement mechanism; and

a frame that holds therein an electronic component module including the electronic component, the block, and the cover.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2016
From: IMAIZUMI, YOSHIHITO
To: YAZAKI CORPORATION
Reel/Frame 040404/0781 →