IP Library Granted Patent US 9,865,345
Granted Patent B2
US 9,865,345 · App. 15/362,010 · Granted Jan 9, 2018

Electronic device including a semiconductor memory having memory arrays with variable resistance storage elements and a bias voltage generator arranged between the arrays

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Quick Facts
Patent No.
US 9,865,345
App. No.
15/362,010
Granted
Jan 9, 2018
Kind
B2
Abstract

An electronic device includes a semiconductor memory device. The semiconductor memory device includes: a word line driving unit for driving a plurality of word lines; a first circuit area including a first cell array arranged at one side of the word line driving unit; a second circuit area including a second cell array arranged at the other side of the word line driving unit; a bias voltage generation unit arranged between the first cell array and the second cell array; a first read control unit; and a second read control unit. The first and second cell arrays include storage cells having variable resistance elements, and the bias voltage generation unit generates a bias voltage based on currents flowing through a first reference resistance element included in the first cell array and a second reference resistance element included in the second cell array.

Claims (38)

1. An electronic device including a semiconductor memory unit, wherein the semiconductor memory unit comprises:

a first circuit area including a plurality of first storage cells, each having a variable resistance element and being selected when a corresponding word line is activated, a first reference resistance element having a first resistance value, and a first read control unit for reading data of a storage cell selected among the plurality of first storage cells based on a bias voltage;

a second circuit area including a plurality of second storage cells, each having a variable resistance element and being selected when a corresponding word line is activated, a second reference resistance element having a second resistance value, and a second read control unit for reading data of a storage cell selected among the plurality of second storage cells based on the bias voltage, the second circuit area being arranged spaced apart from the first circuit area; and

a third circuit area arranged between the first circuit area and the second circuit area, wherein the third circuit area includes a word line driving unit for driving a plurality of word lines, and a bias voltage generation unit for generating the bias voltage based on currents flowing through the first reference resistance element and the second reference resistance element,

wherein the first reference resistance element and the second reference resistance element are arranged adjacent to the third circuit area.

2. The semiconductor memory unit of claim 1 , wherein the first read control unit and the second read control unit generate a reference current based on the bias voltage, and compare the currents flowing through the selected storage cells with the reference current to read the data of the selected storage cells.

3. The semiconductor memory unit of claim 1 , wherein the bias voltage generation unit transfers an external voltage as the bias voltage when a test signal is activated.

4. The semiconductor memory unit of claim 1 , wherein the variable resistance element includes one or more of metal oxide, a phase change material, and a structure in which a tunnel barrier layer is interposed between two ferromagnetic layers.

5. The semiconductor memory unit of claim 1 , wherein the first circuit area includes a first cell and array including the plurality of first storage cells, the second circuit area includes a second cell array including the plurality of second storage cells.

6. The semiconductor memory unit of claim 5 , wherein the first cell array is arranged adjacent to the bias voltage generation unit on one side of the bias voltage generation unit, and the second cell array is arranged adjacent to the bias voltage generation unit on the other side of the bias voltage generation unit.

7. The electronic device according to claim 1 , further comprising a microprocessor which includes:

a control unit for receiving a signal including a command from outside of the microprocessor, and performing extracting, decoding of the command, or controlling input or output of a signal of the microprocessor; and

an operation unit for performing an operation based on a result that the control unit decodes the command; and

a memory unit for storing data for performing the operation, data corresponding to a result of performing the operation, or an address of data for which the operation is performed,

wherein the semiconductor memory unit is part of the memory unit in the microprocessor.

8. The electronic device according to claim 1 , further comprising a processor which includes:

a core unit for performing, based on a command inputted from outside of the processor, an operation corresponding to the command, by using data;

a cache memory unit for storing data for performing the operation, data corresponding to a result of performing the operation, or an address of data for which the operation is performed; and

a bus interface, connected between the core unit and the cache memory unit, for transmitting data between the core unit and the cache memory unit,

wherein the semiconductor memory unit is part of the cache memory unit in the processor.

9. The electronic device according to claim 1 , further comprising a processing system which includes:

a processor for decoding a command received by the processor and controlling an operation for information based on a result of decoding the command;

an auxiliary memory device for storing a program for decoding the command and the information;

a main memory device for calling and storing the program and the information from the auxiliary memory device such that the processor can perform the operation using the program and the information when executing the program; and

an interface device for performing communication between the processor, the auxiliary memory device or the main memory device and outside of the processing system,

wherein the semiconductor memory unit is part of the auxiliary memory device or the main memory device in the processing system.

10. The electronic device according to claim 1 , further comprising a data storage system which includes:

a storage device for storing data and conserving stored data regardless of power supply;

a controller for controlling input and output of data to and from the storage device according to a command inputted from outside of the data storage system;

a temporary storage device for temporarily storing data exchanged between the storage device and the outside; and

an interface for performing communication between at least one of the storage device, the controller and the temporary storage device and the outside,

wherein the semiconductor memory unit is part of the storage device or the temporary storage device in the data storage system.

11. The electronic device according to claim 1 , further comprising a memory system which includes:

a memory for storing data and conserving stored data regardless of power supply;

a memory controller for controlling input and output of data to and from the memory according to a command inputted from outside of the memory system;

a buffer memory for buffering data exchanged between the memory and the outside; and

an interface for performing communication between at least one of the memory, the memory controller and the buffer memory and the outside,

wherein the semiconductor memory unit is part of the memory or the buffer memory in the memory system.

Assignments (5)
CHANGE OF NAME Recorded Mar 2, 2022
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 059150/0657 →
CHANGE OF NAME Recorded Mar 2, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059305/0265 →
MERGER Recorded Mar 2, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K.PANGEA
Reel/Frame 059305/0759 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043848/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2016
From: KIM, DONG-KEUN; TAKAHASHI, MASAHIRO; INABA, TSUNEO
To: SK HYNIX INC.; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 041090/0382 →