Coating compositions for use with an overcoated photoresist
In a preferred aspect, organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that comprise 1) one or more glycidyl groups; and 2) one or more aromatic groups that each comprises two or more substituents that comprise hydroxy, thiol and/or amine moieties. Catechol-containing polymers and methods for producing same also are provided.
1. A method for forming a photoresist relief image, comprising:
a) applying on a substrate a layer of a coating composition comprising:
1) a first resin that comprises one or more glycidyl groups and
2) a second resin that comprises one or more catechol groups;
b) applying a layer of a photoresist composition above the coating composition layer; and
c) exposing the photoresist composition later to activating radiation and developing the exposing photoresist composition layer to provide a photoresist composition relief image.
2. The method of claim 1 wherein the coating composition comprises a resin that comprises both 1) one or more glycidyl groups and 2) one or more aromatic groups that each comprises two or more substituents that comprise hydroxy, thiol and/or amine moieties.
3. The method of claim 1 wherein photoresist relief images are transferred to substrates by a wet etch process.
4. The method of claim 1 wherein the substrate comprises SiO 2 or TiN.
5. The method of claim 1 wherein the one or more catechol groups are phenyl groups that are unsubstituted at ring positions other than linkage to the resin and two hydroxyl ring substituents.
6. A coated substrate comprising:
a substrate having thereon:
a) a coating composition comprising:
1) a first resin that comprises one or more glycidyl groups and
2) a second resin that comprises one or more catechol groups; and
b) a layer of a photoresist composition above the coating composition layer.
7. The substrate of claim 6 wherein the one or more catechol groups are phenyl groups that are unsubstituted at ring positions other than linkage to the resin and two hydroxyl ring substituents.