Optical module

1. An optical module comprising:

an optical subassembly including a plurality of leads and being for converting an optical signal and an electric signal at least from one to the other; and

a wiring board including a wiring pattern and overlapping and electrically connected to the optical subassembly, wherein

the plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power,

the wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead,

the wiring board includes a first region overlapping the optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly,

the pair of differential signal leads are farther away from the second region than the power supply lead,

the pair of differential transmission lines are close together so as to be electromagnetically coupled to each other, and

the optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.

2. The optical module according to claim 1 , wherein

the power supply wiring includes a bypassing portion extending from the power supply lead so as to go therearound while avoiding a direction of the shortest distance from the power supply lead to the second region.

3. The optical module according to claim 2 , further comprising solder bonding the power supply wiring and the power supply lead together, wherein

the power supply wiring further includes a pad extending in the direction of the shortest distance from the power supply lead to the second region,

the power supply lead penetrates the pad, and the solder is disposed on the pad.

4. The optical module according to claim 3 , further comprising a cover layer covering the wiring pattern except for a portion thereof, wherein

the power supply wiring includes, in the first region, a boundary between a portion covered by the cover layer and a portion exposed from the cover layer,

the pad includes, in the first region, a tip closest to the second region, and

the boundary of the power supply wiring is located at a position farther away from the second region than the tip of the pad.

5. The optical module according to claim 1 , wherein

the pitch of the pair of differential signal leads is larger than the pitch of the pair of differential transmission lines in the second region.

6. The optical module according to claim 5 , wherein

the pair of differential transmission lines extend from the pair of differential signal leads in a direction close to each other without extending in a direction away from each other.

7. The optical module according to claim 1 , wherein

the wiring board further includes a ground plane insulated from and overlapping the pair of differential transmission lines, and

the plurality of leads further include a ground lead connected to the ground plane.

8. The optical module according to claim 7 , wherein

the wiring board includes a notch portion provided between the differential signal lead and the power supply lead,

the wiring pattern includes a ground wiring pattern continuous from the ground lead to the notch portion, and

the ground wiring pattern is electrically connected with the optical subassembly through solder provided at the notch portion.