Probe-based data collection system with adaptive mode of probing controlled by local sample properties
A method for testing an integrated circuit (IC) using a nanoprobe, by using a scanning electron microscope (SEM) to register the nanoprobe to an identified feature on the IC; navigating the nanoprobe to a region of interest; scanning the nanoprobe over the surface of the IC while reading data from the nanoprobe; when the data from the nanoprobe indicates that the nanoprobe traverse a feature of interest, decelerating the scanning speed of the nanoprobe and performing testing of the IC. The scanning can be done at a prescribed nanoprobe tip force, and during the step of decelerating the scanning speed, the method further includes increasing the nanoprobe tip force.
1. An apparatus for performing probing on an integrated circuits (IC), comprising:
a stage configured for supporting the IC and configured to enable connecting an IC tester to front side of the IC to conduct tests on the sample;
a prober having a probe tip;
an actuator activating the prober to position the probe tip at a region of interest (ROI) at a back side of the sample, wherein the probe tip is acting as an antenna which amplifies electro-magnetic (EM) field, thereby amplifying electro-optical emission from operating devices within the sample;
collection optics positioned at the backside of the sample and collect photons in proximity to the probe tip;
a controller collecting data signals from the collection optics synchronized with the prober position, and generating map of electro-optical emission over the IC.
2. The apparatus of claim 1 , wherein the controller is further preprogrammed to read a CAD design data corresponding to the sample, and to further control the actuating signals according to the CAD design data indicating dielectric regions and conductive regions.
3. The apparatus of claim 1 , wherein the controller is further preprogrammed to register the prober to an image obtained by a scanning electron microscope outside of an area of interest.
4. The apparatus of claim 1 , wherein the actuator is configured to move the probe tip parallel to the backside of the IC with variable speed and at variable distance between the IC backside and the probe tip.
5. A method of performing integrated circuits (IC) probing using a prober having a probe tip, comprising the steps of:
applying test signals to the IC from a front surface of the IC to thereby cause electro-optical emission from operating p/n junctions within the IC;
placing the probe tip over a back surface of the IC; and,
placing collection optics to collect photons of the electro-optical emission from proximity of the probe tip.
6. The method of claim 5 , further comprising thinning the IC to 100 nm prior to performing the probing.
7. The method of claim 5 , further comprising scanning the probe tip over the back surface of the IC.
8. The method of claim 5 , further comprising scanning the probe tip over the back surface of the IC at variable speed and at variable distance between back surface and the probe tip.
9. The method of claim 5 , further comprising collecting data signals from the collection optics synchronized with position of the probe tip.
10. The method of claim 9 , further comprising generating map of electro-optical emission over the IC.
11. The method of claim 5 , further comprising the steps:
registering the probe tip to the IC outside of an area of interest (ROI); and,
blindly moving the probe tip to the area of interest.
12. The method of claim 11 , wherein blindly moving is performed by moving the probe tip without contacting the sample.
13. The method of claim 12 , further comprising assessing test data quality prior to accelerating the probe tip.