IP Library Granted Patent US 10,061,961
Granted Patent B2
US 10,061,961 · App. 15/368,905 · Granted Aug 28, 2018

Sensor-compatible overlay

Inventors: Roman Ogirko (Lviv, UA); Hans Klein (Pleasanton, CA); David G. Wright (Woodinville, WA); Igor Kolych (Lviv, UA); Andriy Maharyta (Lviv, UA); Hassane El-Khoury (Pleasanton, CA)
Assignee: Cypress Semiconductor Corporation
G06K9/0002G06K9/00053
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Quick Facts
Patent No.
US 10,061,961
App. No.
15/368,905
Granted
Aug 28, 2018
Kind
B2
Abstract

A sensor-compatible overlay is disclosed which uses anisotropic conductive material to increase capacitive coupling of a conductive object through the overlay material to a capacitive sensor. The anisotropic conductive material has increased conductivity in a direction orthogonal to the capacitive sensor. In one embodiment, the overlay is configured to enclose a device which includes a capacitive sensor. In another embodiment, the overlay is configured as a glove.

Claims (40)

1. A sensor-compatible overlay, comprising:

a first portion comprising a first surface and a second surface; and

a second portion disposed at least partly within the first portion, comprising a third surface and a fourth surface, wherein the second portion has:

a first conductivity in a direction substantially orthogonal to the third surface and the fourth surface, and a second conductivity in at least one other direction, wherein the first conductivity is substantially greater than the second conductivity, and wherein the first conductivity is substantially static.

2. The sensor-compatible overlay of claim 1 , wherein the third surface is substantially parallel with the first surface and the fourth surface is substantially parallel with the second surface.

3. The sensor-compatible overlay of claim 1 , wherein the second portion is disposed entirely within the first portion such that the first portion completely surrounds the second portion.

4. The sensor-compatible overlay of claim 1 , wherein the first surface is disposed to be adjacent to a conductive object and the second surface is disposed to be adjacent to a capacitive sensor.

5. The sensor-compatible overlay of claim 4 , wherein the third surface is recessed from the first surface and is disposed to contact the conductive object.

6. The sensor-compatible overlay of claim 1 , wherein the first portion comprises a flexible material.

7. The sensor-compatible overlay of claim 1 , wherein the second portion comprises a flexible material.

8. The sensor-compatible overlay of claim 1 , wherein the sensor-compatible overlay is configured to at least partially enclose a device comprising a conductive sensor.

9. The sensor-compatible material of claim 1 , wherein the sensor-compatible overlay is incorporated in a glove.

10. A method of forming a sensor-compatible material comprising incorporating an anisotropic conductive material at least partly within a first material such that a first surface of the first material is substantially parallel to a third surface of the anisotropic conductive material and a second surface of the first material is substantially parallel to a fourth surface of the anisotropic conductive material, wherein the anisotropic conductive material comprises:

a first conductivity in a direction substantially orthogonal to the third surface and the fourth surface; and

a second conductivity in at least one other direction, wherein the first conductivity is substantially greater than the second conductivity; and

wherein the first conductivity is substantially fixed.

11. The method of claim 10 , further comprising incorporating the anisotropic conductive material entirely within the first material such that the first material completely surrounds the anisotropic conductive material.

12. The method of claim 10 , wherein incorporating the anisotropic conductive material further comprises inserting the anisotropic conductive material in the first material.

13. The method of claim 10 , wherein the first surface is disposed to be adjacent to a conductive object and the second surface is disposed to be adjacent to a capacitive sensor.

14. The method of claim 13 , wherein the third surface is recessed from the first surface and is disposed to contact the conductive object.

15. The method of claim 10 , wherein the first material comprises a flexible material.

16. The method of claim 10 , wherein the anisotropic conductive material comprises a flexible material.

17. The method of claim 10 , further comprising configuring the sensor-compatible material to at least partially enclose a device comprising a capacitive sensor.

18. The method of claim 10 , further comprising configuring the sensor-compatible material as a glove.

19. A system, comprising:

a capacitive sensor;

a sensor controller electrically coupled to the capacitive sensor; and

a protective cover, comprising:

a first surface and a second surface, wherein the first surface is disposed to be adjacent to the capacitive sensor; and

an anisotropic conductive material disposed at least partly within the first material comprising a third surface substantially parallel with the first surface and a fourth surface substantially parallel with the second surface, wherein the anisotropic conductive material comprises:

a first conductivity in a direction substantially orthogonal to the third surface and the fourth surface; and

a second conductivity in at least one other direction, wherein the first conductivity is substantially greater than the second conductivity; and

wherein the first conductivity is substantially unchanging.

20. The system of claim 19 , wherein the anisotropic conductive material is disposed entirely within the first material such that the first material completely surrounds the anisotropic conductive material.

21. The system of claim 19 , wherein the second surface is configured to be adjacent to a conductive object.

22. The system of claim 21 , wherein the fourth surface is recessed from the second surface and is disposed to contact the conductive object.

23. The system of claim 19 , wherein the conductive cover is configured to at least partially enclose the capacitive sensor and sensor controller.

24. The system of claim 19 , wherein the capacitive sensor comprises a self capacitance sensor.

25. The system of claim 19 , wherein the second surface is configured to be conformable to a shape of a conductive object.

26. The system of claim 19 , wherein the fourth surface is configured to be conformable to a shape of a conductive object.

Assignments (5)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
PATENT SECURITY AGREEMENT Recorded Apr 25, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 042326/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2017
From: OGIRKO, ROMAN; KLEIN, HANS; WRIGHT, DAVID; KOLYCH, IGOR; MAHARYTA, ANDRIY; EL-KHOURY, HASSANE
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 041831/0514 →
Continuity (3)
Continuation 15088479 · Apr 1, 2016
Provisional Application 62255220 · Nov 13, 2015
Related Publication 20170147854A1 · May 25, 2017