Image sensor and method of manufacturing the same

1. An image sensor comprising:

a first charge storage region of a first conductive type disposed in a substrate;

a second charge storage region of a second conductive type disposed on one side of the first charge storage region;

a first floating diffusion region spaced apart from the first charge storage region;

a second floating diffusion region spaced apart from the second charge storage region;

a first transfer gate disposed on the substrate between the first charge storage region and the first floating diffusion region in a plan view;

a second transfer gate disposed on the substrate between the second charge storage region and the second floating diffusion region in the plan view;

a first pinning layer of the first conductive type disposed on the first and second charge storage regions; and

a second pinning layer of the second conductive type disposed on the first pinning layer, such that the first pinning layer electrically isolates the second charge storage region from the second pinning layer.

2. The image sensor of claim 1 , further comprising a third charge storage region of the first conductive type disposed in the substrate,

wherein the first and second charge storage regions are disposed on the third charge storage region.

3. The image sensor of claim 1 , further comprising a well region of the first conductive type disposed on one side of the second charge storage region,

wherein the second floating diffusion region and the second transfer gate are disposed on the well region.

4. The image sensor of claim 1 , further comprising a well region of the second conductive type disposed on another side of the first charge storage region,

wherein the first floating diffusion region and the first transfer gate are disposed on the well region.

5. The image sensor of claim 1 , wherein the second charge storage region has a plurality of extending portions which extends to an inside of the first charge storage region to increase a surface area of the interconnection of the first charge storage region and the second charge storage region.

6. An image sensor comprising:

a first charge storage region of a first conductive type disposed in a substrate;

a second charge storage region of a second conductive type disposed in the first charge storage region and laterally exposed through one side of the first charge storage region;

a first floating diffusion region spaced apart from the first charge storage region;

a second floating diffusion region spaced apart from the second charge storage region;

a first transfer gate disposed on the substrate between the first charge storage region and the first floating diffusion region in a plan view;

a second transfer gate disposed on the substrate between the second charge storage region and the second floating diffusion region in the plan view; and

a pinning layer of the second conductive type disposed on the first charge storage region.

7. The image sensor of claim 6 , further comprising a well region of the first conductive type disposed on one side of the second charge storage region,

wherein the second floating diffusion region and the second transfer gate are disposed on the well region.

8. The image sensor of claim 6 , further comprising a well region of the second conductive type disposed on another side of the first charge storage region,

wherein the first floating diffusion region and the first transfer gate are disposed on the well region.

9. A method of manufacturing an image sensor, the method comprising:

forming a first transfer gate and a second transfer gate spaced apart from each other on a substrate;

forming a first charge storage region of a first conductive type in the substrate between the first and second transfer gates;

forming a second charge storage region of a second conductive type, adjacent the first charge storage region;

forming a first floating diffusion region in the substrate, the first floating diffusion region being spaced apart from the first charge storage region, and the first transfer gate being disposed on the substrate between the first charge storage region and the first floating diffusion region in a plan view;

forming a second floating diffusion region in the substrate, the second floating diffusion region being spaced apart from the second charge storage region, and the second transfer gate being disposed on the substrate between the second charge storage region and the second floating diffusion region in the plan view;

forming a first pinning layer of the first conductive type disposed on the first and second charge storage regions; and

forming a second pinning layer of the second conductive type disposed on the first pinning layer, such that the first pinning layer electrically isolates the second charge storage region from the second pinning layer.

10. The method of claim 9 , wherein the second charge storage region is arranged in the substrate between the first transfer gate and the second transfer gate, the second charge storage region being disposed on one side of the first charge storage region.

11. The method of claim 10 , further comprising forming a third charge storage region of the first conductive type in the substrate,

wherein the first and second charge storage regions are formed on the third charge storage region.

12. The method of claim 10 , further comprising:

forming a well region of the first conductive type in the substrate, wherein the second floating diffusion region and the second transfer gate are formed on the well region of the first conductive type; and

forming a well region of the second conductive type in the substrate, wherein the first floating diffusion region and the first transfer gate are formed on the well region of the second conductive type.

13. The method of claim 10 , wherein the second charge storage region has a plurality of extending portions which extend to an inside of the first charge storage region to increase a surface area of the interconnection of the first charge storage region and the second charge storage region.

14. The method of claim 9 , wherein the second charge storage region is arranged in the first charge storage region, and wherein the second charge storage region is laterally exposed through one side of the first charge storage region.

15. The method of claim 14 , further comprising forming a pinning layer of the second conductive type on the first charge storage region.