Multilayer wiring board for an electronic device
View Patent ↗An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.
1. An electronic assembly comprising:
a first flexible insulating film having first and second opposed major surfaces;
a flexible semiconductor component positioned within the flexible insulating film and having a thickness of 50 micrometers or less, the flexible semiconductor component having an active front surface and a rear surface, wherein the flexible semiconductor component includes an active front face, an opposed rear face, and opposed edge surfaces extending between the front and rear surfaces;
a first patterned wiring film extending parallel to the first major surface and along the rear surface of the flexible semiconductor component;
a second patterned wiring film extending adjacent the second surface of the flexible insulating film;
a plurality of conductive posts extending through the flexible insulating film and electrically connecting the first and second patterned wiring films;
a second flexible insulating film extending along the rear surface of the flexible semiconductor component and extending along a portion of the first patterned wiring film that extends along the rear surface of the flexible semiconductor component; and
a third flexible insulating film extending along the front face of the semiconductor component;
wherein the flexible semiconductor component and the first, second, and third flexible insulating films are configured to flex so as to allow the electronic assembly to be in a bent state.
2. The electronic assembly of claim 1 , wherein at least some of the plurality of conductive posts include a first end joined to the first patterned wiring film and a second end joined to the second patterned wiring film.
3. The electronic assembly of claim 2 , wherein the flexible semiconductor component directly connects to the second patterned wiring film and wherein the flexible semiconductor component is electrically connected to the first patterned wiring film through at least one of the plurality of conductive posts.
4. The electronic assembly of claim 3 , wherein the plurality of conductive posts are a first plurality of conductive posts, and wherein the electronic assembly further comprises a second plurality of conductive posts, the second plurality of conductive posts connecting bond pads of the flexible semiconductor component with the second patterned wiring film.
5. The electronic assembly of claim 4 , wherein the first plurality of conductive posts has a first height and the second plurality of conductive posts has a second height, the first and second heights being different from one another.
6. The electronic assembly of claim 4 , wherein the second plurality of conductive posts directly join bond pads of the semiconductor component to the second patterned wiring film.
7. The electronic assembly of claim 6 , wherein the second plurality of conductive posts contact the bond pads of the flexible semiconductor component and a surface of the second patterned wiring film.
8. The electronic assembly of claim 1 , wherein the plurality of conductive posts are etched posts.
9. The electronic assembly of claim 1 , further comprising a plurality of external contacts exposed at one or more external surfaces of the electronic assembly, the external contacts conductively connected to at least one of the first and second patterned wiring films.
10. The electronic assembly of claim 9 , wherein at least some of the plurality of external contacts are exposed at a surface of one of the first and second patterned wiring films.
11. The electronic assembly of claim 10 , wherein the at least some of the plurality of the external contacts project outward from the surface of the second patterned metal wiring film.
12. The electronic assembly of claim 9 , wherein the plurality of external contacts consist essentially of copper.
13. The electronic assembly of claim 12 , wherein the first and second patterned wiring films consist essentially of copper.
14. The electronic assembly of claim 1 , further comprising at least one other flexible semiconductor component having a thickness of 50 micrometers or less and being disposed between the first and second patterned wiring films.
15. A flexible electronic assembly comprising:
a first flexible insulating film having first and second opposed major surfaces;
a flexible semiconductor component positioned within the flexible insulating film and having a thickness of 50 micrometers or less, the flexible semiconductor component having an active front surface and a rear surface, wherein the flexible semiconductor component includes an active front face, an opposed rear face, and opposed edge surfaces extending between the front and rear surfaces;
a first wiring film extending along the first major surface and the rear surface of the flexible semiconductor component;
a second wiring film extending adjacent the second surface of the flexible insulating film;
a plurality of etched conductive posts disposed within the flexible insulating film and contacting the first and second wiring films so as to conductively connect the first and second wiring films;
a second insulating film extending along the rear surface of the semiconductor element and extending along a portion of the first patterned wiring film that extends along the rear surface of the flexible semiconductor component;
a third insulating film extending along the front face of the semiconductor component and at least some portions of the first wiring film; and
a plurality of external contacts exposed at one or more external surfaces of the electronic assembly, the plurality of external contacts conductively connected to at least one of the first and second wiring films,
wherein the flexible semiconductor component and the first, second, and third flexible insulating films are configured to exhibit flexibility so as to move back and forth between a stationary state and a bent state,
wherein the flexible semiconductor component directly connects to the second wiring film, and
wherein the flexible semiconductor component is electrically connected to the first wiring film extending along the rear surface of the flexible semiconductor component through at least one of the plurality of etched conductive posts.
16. The flexible electronic assembly of claim 15 , wherein the plurality of etched conductive posts are a first plurality of conductive posts, and wherein the assembly further comprises a second plurality of conductive posts, the second plurality of conductive posts connecting bond pads of the flexible semiconductor component with the second wiring film.
17. The flexible electronic assembly of claim 16 , wherein the first plurality of conductive posts has a first height and the second plurality of conductive posts has a second height, the first and second heights being different from one another.
18. The flexible electronic assembly of claim 16 , wherein bond pads of the flexible semiconductor component face toward a surface of the second wiring film, the bond pads being surface-mounted to contacts exposed at the surface of the second wiring film.
19. The flexible electronic assembly of claim 18 , wherein the second plurality of conductive posts directly join the bond pads to the second wiring film.
20. The flexible electronic assembly of claim 19 , wherein the flexible semiconductor component is embedded within the first flexible insulating film, such that the first flexible insulating film covers the opposed edge surfaces of the flexible semiconductor component and includes a major surface adjacent a major surface of the second flexible insulating film.