IP Library Granted Patent US 10,392,469
Granted Patent B2
US 10,392,469 · App. 15/376,022 · Granted Aug 27, 2019

Epoxy resin compositions for production of storage-stable composites

Inventors: Martina Ortelt (Flein, DE); Dirk Fuchsmann (Haltern am See, DE); Sebastian de Nardo (Gelsenkirchen, DE); Eike Langkabel (Wegberg, DE); Britta Kohlstruk (Gladbeck, DE); Annette Sandkuehler (Marl, DE); Ralph Aldridge (Duelmen, DE); Katharina Karns (Marl, DE)
Assignee: Evonik Degussa GmbH
C08G59/506B32B27/26B32B27/38C08G59/245C08G59/3227C08G59/50C08G59/5073C08G59/56C08J5/04C08J5/042C08J5/24C08L63/00C08J2363/00
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Quick Facts
Patent No.
US 10,392,469
App. No.
15/376,022
Granted
Aug 27, 2019
Kind
B2
Abstract

Epoxy resin compositions containing at least one resin component and at least one hardener component are suitable as a thermoset matrix for production of semi-finished fiber matrix products and cured fiber matrix laminates known as composites.

Claims (37)

1. An epoxy resin composition, comprising:

A) at least one epoxy compound selected from the group consisting of a diglycidyl ether based on bisphenol A and a diglycidyl ether based on bisphenol F;

B) a hardener composition comprising:

B1) 65%-99% by weight of at least one polyamine based on triacetonediamine, and

B2) 1%-35% by weight of at least one compound having at least one functional group reactive toward epoxy groups in component A) selected from the group consisting of

(B2a) isophoronediamine,

(B2b) 4,4′-diaminodicyclohexylmethane, 2,4′-diaminodicyclohexylmethane, 2,2′-diaminodicyclohexylmethane, alone or in mixtures thereof, and

(B2c) a mixture of 2,2,4-trimethylhexamethylenediamine and 2,4,4-trimethylhexamethylenediamine,

wherein B1 and B2 total 100% by weight of B), and the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1, and

C) 0.1%-10% by weight of at least one curing accelerator selected from the group consisting of an imidazole and an imidazole derivative,

wherein the amounts of A)-C) add up to 100% by weight.

2. The epoxy resin composition according to claim 1 , wherein the at least one polyamine based on triacetonediamine, B1), is selected from the group consisting of 2,2,6,6-tetramethyl-4-aminopiperidine (TAD), hexamethylenebis(4-amino-2,2,6,6-tetramethylpiperidine), N-butyl-4-amino-2,2,6,6-tetramethylpiperidine, N,N-dimethylaminopropyl-4-amino-2,2,6,6-tetramethylpiperidine, N-propyl-4-amino-2,2,6,6-tetramethylpiperidine, N-isopropyl-4-amino-2,2,6,6-tetramethylpiperidine, N-hydroxyethyl-4-amino-2,2,6,6-tetramethylpiperidine, N-methoxyethyl-4-amino-2,2,6,6-tetramethylpiperidine, N-methoxyethyl-4-amino-2,2,6,6-tetramethylpiperidine, N′,N′-dimethylaminoethyl-4-amino-2,2,6,6-tetramethylpiperidine, N-morpholinoethyl-4-amino-2,2,6,6-tetramethylpiperidine, N-piperazinoethyl-4-amino-2,2,6,6-tetramethylpiperidine, and 4-morpholino-2,2,6,6-tetramethylpiperidine.

3. The epoxy resin composition according to claim 1 , wherein B1) is 2,2,6,6-tetramethyl-4-aminopiperidine (TAD) and B2) is isophoronediamine.

4. A composition comprising the epoxy resin composition according to claim 1 and D) an additive.

5. A storage-stable composite, obtained from the epoxy resin composition according to claim 1 .

6. A storage-stable composite, obtained from

1) at least one fibrous carrier, and

2) the epoxy resin composition according to claim 1 .

7. A process for producing a storage-stable composite according to claim 6 , said process comprising:

I. providing said epoxy resin composition,

II. impregnating the fibrous carrier with the composition from I,

III. converting the epoxy resin composition from I at temperatures of 23-200° C. to a conversion of 1%-90%,

IV. unwinding or laying out the storage-stable composite.

8. A storage-stable prepreg or storage-stable sheet moulding compound composite, obtained from

1) at least one fibrous carrier, and

2) the epoxy resin composition according to claim 1 .

9. A process for producing a storage-stable sheet moulding compound composite, said process comprising:

I. providing the epoxy resin composition according to claim 1 ,

II. impregnating a fibrous carrier with the composition from I,

III. converting the epoxy resin composition from I at temperatures of 23-200° C. to a conversion of 1%-90%, to obtain a reactive sheet moulding compound composite, and

IV. laying out the reactive sheet moulding compound composite.

10. A process for producing a storage-stable prepreg, said process comprising:

I. providing the epoxy resin composition according to claim 1 ,

II. impregnating a fibrous carrier with the composition from I,

III. converting the epoxy resin composition from I at temperatures of 23-200° C. to a conversion of 1%-90%, to obtain a reactive prepreg, and

IV. laying out the reactive prepreg.

11. A composite component, obtained from at least one fibrous carrier and at least one crosslinked epoxy resin composition, wherein said epoxy resin composition is as defined in claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Nov 18, 2019
From: EVONIK DEGUSSA GMBH
To: EVONIK OPERATIONS GMBH
Reel/Frame 051045/0872 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2017
From: ORTELT, MARTINA; FUCHSMANN, DIRK; DE NARDO, SEBASTIAN; LANGKABEL, EIKE; KOHLSTRUK, BRITTA; SANDKUEHLER, ANNETTE; ALDRIDGE, RALPH; KARNS, KATHARINA
To: EVONIK DEGUSSA GMBH
Reel/Frame 041528/0702 →
Priority Claims (2)
EP 15199598 · Dec 11, 2015 · regional
EP 16201591 · Dec 1, 2016 · regional
Continuity (1)
Related Publication 20170166687A1 · Jun 15, 2017
Cited By (1)
US 12,674,039