SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device of an embodiment includes a semiconductor layer, a gate electrode, and a charge storing layer provided between the semiconductor layer and the gate electrode. The charge storing layer includes polyoxometalates that contain copper (Cu) and tungsten (W).
1 . A semiconductor memory device, comprising:
a semiconductor layer;
a gate electrode; and
a charge storing layer provided between the semiconductor layer and the gate electrode, the charge storing layer including polyoxometalates containing copper (Cu) and tungsten (W).
2 . The device according to claim 1 , wherein each of the polyoxometalates includes a chemical structure described by a formula (1):
Cu x W y O z (1)
in the above formula (1), x, y, and z are positive numbers, x is not larger than 1, y is not smaller than 6 and not larger than 12, and z is not smaller than 12 and not larger than 40.
3 . The device according to claim 1 , wherein each of the polyoxometalates includes a chemical structure described by a formula (2):
(Cu x W y O z ) 6− (2)
in the above formula (2), x, y, and z are positive numbers.
4 . The device according to claim 1 , wherein the charge storing layer includes at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
5 . The device according to claim 1 , wherein the charge storing layer includes a linker unit containing at least one chemically modifying group selected from a group consisting of an ether group, a silyl ether group, a dimethylsilyl ether group, a diethylsilyl ether group, a carboxy ester group, a sulfonyl ester group, a phosphonate ester group, an amide group, and a thioether group.
6 . The device according to claim 1 , wherein the charge storing layer includes a linker unit described by a formula (3):
LX-(LM)-LY (3)
in the above formula (3), LX is at least one chemically modifying group selected from a group consisting of an ether group, a silyl ether group, a dimethylsilyl ether group, a diethylsilyl ether group, a carboxy ester group, a sulfonyl ester group, a phosphonate ester group, an amide group, and a thioether group; LY is at least one second cation selected from a group consisting of an ammonium ion, a trimethylammonium ion, a triethylammonium ion, a tripropylammonium ion, a tributylammonium ion, a tripentylammonium ion, a trihexylammonium ion, a triheptylammonium ion, a trioctylammonium ion, a pyridinium ion, an anilinium ion, and an imidazolium ion; and LM may or may not exist, and when existing, LM is at least one carbon chain structure selected from a group consisting of a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tridecylene group, a tetradecylene group, a pentadecylene group, a hexadecylene group, a heptadecylene group, an octadecylene group, a nonadecylene group, an icosylene group, a phenylene group, a biphenylene group, and a terphenylene group.
7 . The device according to claim 6 , wherein the LX in the linker unit is chemically bonded to a region on the semiconductor layer side or a region on the gate electrode side, and the LY is chemically bonded to the polyoxometalate.
8 . The device according to claim 1 , wherein the charge storing layer contains water (H 2 O).
9 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (4):
in the above formula (4), n is an integer not smaller than 1, x, y, and z are positive numbers, and (+)Ion is at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
10 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (5):
in the above formula (5), x, y, z, and m are positive numbers, and (+)Ion is at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
11 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (6):
in the above formula (6), x, y, z, and m are positive numbers, x is not larger than 1, y is not smaller than 6 and not larger than 12, z is not smaller than 12 and not larger than 40, m is not smaller than 1 and not larger than 10, and (+)Ion is at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
12 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (7):
in the above formula (7), m is a number not smaller than 1 and not larger than 10, and (+)Ion is at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
13 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (8):
in the above formula (8), (+)Ion is at least one first cation selected from a group consisting of a tetramethylammonium ion, a tetraethylammonium ion, a tetrapropylammonium ion, a tetrabutylammonium ion, a rubidium ion, a cesium ion, and a barium ion.
14 . The device according to claim 1 , wherein the charge storing layer includes a chemical structure described by a formula (9):
15 . The device according to claim 1 , wherein the charge storing layer is a monomolecular layer.
16 . The device according to claim 1 , further comprising
a first insulating layer provided between the semiconductor layer and the charge storing layer.
17 . The device according to claim 1 , further comprising
a second insulating layer provided between the charge storing layer and the gate electrode.
18 . A semiconductor memory device, comprising:
a stacked structure formed by alternately stacking insulating layers and gate electrodes;
a semiconductor layer provided facing the gate electrode; and
a charge storing layer provided between the semiconductor layer and at least one of the gate electrodes, the charge storing layer including polyoxometalates containing copper (Cu) and tungsten (W).
19 . The device according to claim 18 , wherein each of the polyoxometalates includes a chemical structure described by a formula (1):
Cu x W y O z (1)
in the above formula (1), x, y, and z are positive numbers, x is not larger than 1, y is not smaller than 6 and not larger than 12, and z is not smaller than 12 and not larger than 40.
20 . A semiconductor memory device, comprising:
a semiconductor layer;
a gate electrode; and
a charge storing layer provided between the semiconductor layer and the gate electrode, the charge storing layer containing copper (Cu), tungsten (W), and oxygen (O) and including a structure in which the tungsten and the oxygen surround the copper.