IP Library Granted Patent US 10,117,366
Granted Patent B2
US 10,117,366 · App. 15/379,290 · Granted Oct 30, 2018

Spring energized seals and related methods

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,117,366
App. No.
15/379,290
Granted
Oct 30, 2018
Kind
B2
Abstract

Seal assemblies with a seal body having an inside flange and an outside flange that are biased outwardly away from one another by a spring energizer, such as a canted coil spring or a V-spring. The seal assemblies further include EMI shielding by incorporating at least one spring energizer that provides at least part of a conductive path between a housing and a pin. The conductive path can alternatively be provided by two different spring energizers and optionally with a conductive strip or trace or via a conductive contact ring element. The present seal assemblies are usable in applications having the needle for both sealing and EMI shielding.

Claims (25)

1. A seal assembly comprising a seal element having an inside flange and an outside flange defining a first spring groove having a first spring energizer located therein and biasing the inside flange and the outside flange away from one another;

a conductive path defined at least in part by a second spring energizer located in a second spring groove and a third spring energizer located in a third spring groove in electrical communication with one another for EMI shielding.

2. The seal assembly of claim 1 , wherein the conductive path is further defined by a conductive ring element in contact with the second spring energizer and the third spring energizer.

3. The seal assembly of claim 1 , wherein the conductive path is further defined by a conductive strip connecting the second spring energizer to the third spring energizer.

4. The seal assembly of claim 1 , further comprising a conductive ring element latched to the seal element.

5. The seal assembly of claim 4 , wherein an electrical path is provided between the second spring energizer and the third spring energizer through a body section of the conductive ring element.

6. The seal assembly of claim 5 , wherein the third spring groove comprises two sidewalls and a bottom wall located between the two sidewalls.

7. The seal assembly of claim 6 , wherein one of the two sidewalls is formed by a surface of the seal element.

8. The seal assembly of claim 7 , wherein the second spring groove comprises two sidewalls and a bottom wall.

9. The seal assembly of claim 8 , wherein the bottom wall of the second spring groove is tapered relative to at least one of the two sidewalls.

10. The seal assembly of claim 4 , wherein the conductive ring element comprises a channel defined by an inside flange and an outside flange and wherein a latching arm extends from a center channel section of the seal element and into the channel.

11. A seal assembly comprising a seal element having an inside flange and an outside flange defining a first spring groove, said first spring groove having a first spring energizer located therein and biasing the inside flange away from the outside flange;

a conductive ring element in mechanical engagement with the seal element, said conductive ring element having a body with an outside diameter, an inside diameter, and a spring groove along the inside diameter; and

a conductive path defined at least in part by a second spring energizer located in the spring groove along the inside diameter of the conductive ring element for EMI shielding.

12. The seal assembly of claim 11 , wherein a leaf spring is formed with the conductive ring element for locking the seal assembly to a housing or a pin.

13. The seal assembly of claim 11 , wherein the spring groove of the body of the conductive ring element is a second spring groove, and further comprising a third spring energizer located in a third spring groove of the conductive ring element for EMI shielding.

14. The seal assembly of claim 13 , wherein the second spring energizer and the third spring energizer are in electrical communication with one another through the body of the conductive ring element.

15. A seal assembly comprising a seal element having an inside flange, an outside flange, and a center channel section defining a first spring groove;

the seal assembly further comprising a second spring groove spaced from a third spring groove and spaced from the first spring groove; and

wherein a conductive path is defined at least in part by a spring energizer located in the second spring groove and a spring energizer located in the third spring groove being in electrical communication with one another for EMI shielding.

16. The seal assembly of claim 15 , further comprising a biasing element located in the first spring groove biasing the inside flange and the outside flange away from one another.

17. The seal assembly of claim 16 , wherein the biasing element is a V-spring.

18. The seal assembly of claim 15 , further comprising a conductive ring element having the second spring groove and the third spring groove.

19. The seal assembly of claim 18 , wherein the third spring groove comprises two sidewalls and a bottom wall located between the two sidewalls.

20. The seal assembly of claim 18 , wherein one of the two sidewalls is formed by a surface of the seal element.

Assignments (7)
RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS (PATENTS) AT REEL 067175/FRAME 0740 Recorded Feb 27, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
Reel/Frame 070347/0014 →
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
RELEASE OF SECURITY INTEREST Recorded Apr 23, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC
Reel/Frame 067200/0800 →
IP SECURITY AGREEMENT Recorded Apr 22, 2024
From: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 067175/0740 →
AMENDED AND RESTATED PATENT COLLATERAL SECURITY AND PLEDGE AGREEMENT Recorded Sep 18, 2020
From: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 054304/0388 →
CHANGE OF NAME Recorded Apr 15, 2020
From: BAL SEAL ENGINEERING, INC.
To: BAL SEAL ENGINEERING, LLC
Reel/Frame 052410/0399 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: DILMAGHANIAN, FARSHID; RUST, STEPHEN; BARRALON, JACQUES; KIM, JIN
To: BAL SEAL ENGINEERING, INC.
Reel/Frame 040738/0131 →
Cited By (2)
US 12,253,172 US 12,560,237