IP Library Granted Patent US 10,357,841
Granted Patent B2
US 10,357,841 · App. 15/380,247 · Granted Jul 23, 2019

Metal cap assembly for optical communications

Inventors: Ramesh Kothandapani (Singapore, SG); Chee Kong Lee (Singapore, SG)
Assignee: MATERION CORPORATION
B23K1/0016B23K35/0222B23K35/3013C22C5/02H01L23/04H01S5/02296H05K5/0095H05K5/03H05K5/04H05K5/062B23K2101/40B32B38/08H01L21/50H01L2924/0002Y10T156/1052
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Quick Facts
Patent No.
US 10,357,841
App. No.
15/380,247
Granted
Jul 23, 2019
Kind
B2
Abstract

A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.

Claims (11)

1. A method of forming at least one window for attachment to a metal cap assembly, comprising:

coating each side of an associated wafer;

forming a pattern on one side of the associated wafer;

layering a metallization seal ring onto the coating of the one side of the associated wafer in accordance with the pattern formed thereon; and

dicing the wafer in accordance with the pattern to form the at least one window, wherein the pattern is formed around the perimeter of the at least one window.

2. The method according to claim 1 , wherein layering the metallization seal ring onto the coating of the one side of the associated wafer in accordance with the pattern formed thereon further comprises layering a seed layer, an intermediate layer and a top layer onto said pattern.

3. The method according to claim 2 , wherein the seed layer comprises chromium, the intermediate layer comprises nickel, and the top layer comprises gold.

4. The method according to claim 3 , wherein attachment of the at least one window to the cap assembly comprises forming a hermetic seal between the at least one window and a back side of a housing of the metal cap assembly using a first solder pre-form inserted therebetween, wherein the housing includes:

a back side of the housing, which includes an opening therethrough; and

a first and second side of the housing, which both extend past the back side of the housing,

wherein the at least one window is configured to contact the back side of the housing covering the opening, but does not extend past the first and second sides of the housing.

Assignments (2)
SECURITY INTEREST Recorded Sep 25, 2019
From: MATERION CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050493/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2016
From: KOTHANDAPANI, RAMESH; LEE, CHEE KONG
To: MATERION CORPORATION
Reel/Frame 040995/0966 →
Continuity (3)
Division 14335042 · Jul 18, 2014
Provisional Application 61856303 · Jul 19, 2013
Related Publication 20170095870A1 · Apr 6, 2017