Multi-layer ceramic capacitor and method of producing the same
A multi-layer ceramic capacitor includes a multi-layer unit, side margins, and bonding units. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margins cover the multi-layer unit from a second direction orthogonal to the first direction. The bonding units are each disposed between the multi-layer unit and each of the side margins and have higher silicon content than the ceramic layers and the side margins.
1. A multi-layer ceramic capacitor, comprising:
a multi-layer unit that includes
ceramic layers laminated in a first direction, and
internal electrodes disposed between the ceramic layers;
side margins that cover side surfaces of the multi-layer unit from a second direction orthogonal to the first direction; and
bonding units that are each disposed between the multi-layer unit and each of the side margins and have higher silicon content than the ceramic layers and the side margins,
wherein the bonding units cover entire areas of the side surfaces of the multi-layer unit covered by the side margins.
2. The multi-layer ceramic capacitor according to claim 1 , wherein
each of the bonding units has a thickness of 0.5 μm or more and 5 μm or less.
3. The multi-layer ceramic capacitor according to claim 1 , wherein
the bonding units include glass phases containing silicon, the glass phases being unevenly distributed.
4. The multi-layer ceramic capacitor according to claim 3 , wherein
the glass phases contain at least one of barium, manganese, magnesium, boron, vanadium, holmium, aluminum, calcium, zinc, potassium, tin, and zirconium.
5. The multi-layer ceramic capacitor according to claim 4 , wherein
the ceramic layers are polycrystals having a Perovskite structure containing barium and titanium, and
the glass phases contain barium.
6. A method of producing a multi-layer ceramic capacitor, comprising:
preparing an unsintered multi-layer chip that includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers;
producing a body by providing side margins to side surfaces of the multi-layer chip via bonding units, the side surfaces being oriented in a second direction orthogonal to the first direction, the bonding units having higher silicon content than the ceramic layers and the side margins and covering entire areas of the side surfaces of the multi-layer chip; and
sintering the body.
7. The method of producing a multi-layer ceramic capacitor according to claim 6 , wherein
the sintering the body includes generating molten phases in the bonding units, the molten phases containing silicon.