Production method of electronic component board with uncut portions for heat radiating portions
An electronic component board is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating plate, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion. Additional steps of the method include providing the metal plate, the insulation plate, and an electrical component, and electrically connecting the electrical component to the plurality of bus bars.
1. A production method of an electronic component board comprising the steps of:
providing a metal plate, an insulation plate, and an electrical component;
die-cutting the metal plate into a plurality of bus bars and a band-shaped connecting portion connected to the plurality of bus bars, having a constant width, and positioned at an outer edge of the metal plate;
attaching the plurality of bus bars connected to the band shaped connecting portion to an insulating plate;
while leaving a part of the band shaped connecting portion uncut, cutting a remaining of the band shaped connecting portion;
forming a heat radiating portion from bending the uncut portion of the connecting portion; and
electrically connecting the electrical component to the plurality of bus bars to produce the electronic component board.
2. The production method according to claim 1 , wherein the plurality of bus bars including a component mount portion on which the electronic component is mounted; a terminal portion to which an external terminal is connected; an intermediate portion positioned between the component mount portion and the terminal portion, and a plurality of heat radiating portions different from the terminal portion, and provided along an outer periphery of the insulating plate.