GLASS PLATE AND METHOD FOR MANUFACTURING SAME
The glass plate according to the present invention has a buffer layer containing a plurality of sulfate crystals on a bottom surface which is brought into contact with a molten metal during formation in accordance with a float method, and the plurality of sulfate crystals have a median value of equivalent circle diameters of 350 nm or smaller as observed from a thickness direction.
1 . A glass plate having a buffer layer comprising a plurality of sulfate crystals on a bottom surface which is brought into contact with a molten metal during formation in accordance with a float method,
wherein the plurality of sulfate crystals have a median value of equivalent circle diameters of 350 nm or smaller as observed from a thickness direction.
2 . A glass plate having a plurality of altered areas higher in etching rate than other portions on a bottom surface which is brought into contact with a molten metal during formation in accordance with a float method,
wherein the plurality of altered areas have a median value of equivalent circle diameters of 400 nm or smaller as observed from a thickness direction.
3 . A method for manufacturing a glass plate, comprising a process of forming a buffer layer comprising a plurality of sulfate crystals on a bottom surface which is brought into contact with a molten metal during formation in accordance with a float method,
wherein the plurality of sulfate crystals have a median value of equivalent circle diameters of 350 nm or smaller as observed from a thickness direction.
4 . The method for manufacturing a glass plate according to claim 3 , further comprising a process of washing the bottom surface to remove the buffer layer,
wherein the bottom surface has a plurality of altered areas higher in etching rate than other portions and
the plurality of altered areas have a median value of equivalent circle diameters of 400 nm or smaller as observed from the thickness direction.
5 . The method for manufacturing a glass plate according to claim 4 , further comprising a process of etching the bottom surface by an aqueous solution containing hydrofluoric acid,
wherein the bottom surface has an arithmetic mean roughness of 1.1 nm or smaller and a maximum valley depth of 7.0 nm or smaller.