Ultrasound transducer and method for wafer level front face attachment
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.
1. An ultrasound transducer, comprising:
a piezoelectric layer;
a matching layer for acoustic impedance matching, one surface of the matching layer electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forming a signal pad within a front face of the ultrasound transducer; and
a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer.
2. The ultrasound transducer of claim 1 , wherein the base package is electrically conductive, and wherein the ultrasound transducer generates an acoustic signal by coupling a voltage signal across the ground pad and the signal pad.
3. The ultrasound transducer of claim 1 , further comprising a non-conductive glue extending vertically relative to the piezoelectric layer and separating the base package from the piezoelectric layer.
4. The ultrasound transducer of claim 3 , wherein the non-conductive glue forms a non-conductive groove within the front face of the ultrasound transducer.
5. The ultrasound transducer of claim 4 , wherein the non-conductive groove separates the ground pad from the signal pad.
6. The ultrasound transducer of claim 1 , further comprising a conductive backing layer between the piezoelectric layer and the base package.
7. The ultrasound transducer of claim 6 , further comprising a dematching layer between the piezoelectric layer and the conductive backing layer.
8. The ultrasound transducer of claim 6 , wherein the conductive backing layer is a first backing layer and further comprising a second backing layer with one surface in contact with the base package along the back face of the ultrasound transducer.
9. The ultrasound transducer of claim 1 , further comprising a backing layer in contact with the base package along the back face of the ultrasound transducer.
10. An ultrasound transducer assembly, comprising:
a flat substrate, and
an ultrasound transducer having a front face mounted to the flat substrate, the front face configured for dicing into a plurality of individual transducers, where one or more dicing lines extend along a ground pad formed within the front face, and further comprising:
the ground pad electrically coupled to a first surface of a piezoelectric layer, the ground pad formed within the front face by a base package extending vertically from a back face of the ultrasound transducer,
a signal pad electrically coupled to a second surface of the piezoelectric layer, the signal pad formed by a matching layer, and
a non-conductive groove separating the ground pad and the signal pad.
11. The ultrasound transducer assembly of claim 10 , wherein the back face of the ultrasound transducer is formed by the base package.
12. The ultrasound transducer assembly of claim 10 , wherein the non-conductive groove is formed by a non-conductive glue, and the non-conductive glue extends vertically relative to the front face and separates the base package from the piezoelectric layer.
13. The ultrasound transducer assembly of claim 10 , further comprising a second ground pad within the front face, wherein the second ground pad is formed by the base package.
14. The ultrasound transducer assembly of claim 10 , wherein the flat substrate includes one surface printed with a circuit, and wherein the circuit is electrically coupled to a coaxial cable.
15. The ultrasound transducer assembly of claim 10 , wherein the plurality of individual transducers comprises a single element transducer.
16. The ultrasound transducer assembly of claim 15 , wherein the single element transducer is a hexagonal transducer.
17. The ultrasound transducer assembly of claim 10 , wherein the front face is configured for dicing into a plurality of individual transducers of various shapes.
18. The ultrasound transducer assembly of claim 17 , wherein the plurality of individual transducers of various shapes includes a single element transducer.
19. The ultrasound transducer assembly of claim 18 , wherein the single element transducer is a hexagonal transducer.
20. The ultrasound transducer assembly of claim 10 , wherein the ground pad is formed within the front face.