COMPRESSION FIT HEAT SINK FOR ELECTRONIC COMPONENTS
An electronic assembly includes a printed-circuit-board, an electronic-component, and a heat-sink-element. The printed-circuit-board has a first-surface and a second-surface opposite said first surface. The printed-circuit-board defines a via that connects the first-surface to the second-surface. The electronic-component defines a top-surface and a mounting-surface. The mounting-surface is in direct-contact with the printed-circuit-board. The heat-sink-element is in compressive-contact with both the electronic-component and the printed-circuit-board. The heat-sink-element defines a fin, a shank, and a contact-section therebetween. The contact-section rests on the top-surface, the fin extends above the top-surface, and the shank extends through the via of the printed-circuit-board and beyond the second-surface. The heat-sink-element is configured to transfer heat from the contact-section to the fin and the shank.
1 . An electronic assembly, comprising:
a printed-circuit-board having a first-surface and a second-surface opposite said first surface, said printed-circuit-board defining a via that connects the first-surface to the second-surface;
an electronic-component, said electronic-component defining a top-surface and a mounting-surface, wherein the mounting-surface is in direct-contact with the printed-circuit-board; and
a heat-sink-element in compressive-contact with both the electronic-component and the printed-circuit-board, said heat-sink-element defining only a single fin, a shank, and a contact-section therebetween, wherein the contact-section rests on the top-surface, the single fin extends above the top-surface, and the shank extends through the via of the printed-circuit-board and beyond the second-surface, and wherein the heat-sink-element is configured to transfer heat from the contact-section to the single fin and the shank.
2 . The electronic assembly in accordance with claim 1 , wherein the shank has an interference-fit with the via.
3 . The electronic assembly in accordance with claim 2 , wherein a wall of the via is metallized and the shank is metallurgically bonded to the wall of the via.
4 . The electronic assembly in accordance with claim 3 , wherein the printed-circuit-board contains a conductive-trace and the wall of the via is in contact with the conductive-trace.
5 . The electronic assembly in accordance with claim 1 , wherein the heat-sink-element imparts a compressive force normal to the top-surface of the electronic-component.
6 . The electronic assembly in accordance with claim 1 , wherein the heat-sink-element is comprised of a conductive-material.
7 . The electronic assembly in accordance with claim 6 , wherein the conductive-material is selected from the list of copper, aluminum, nickel, silver, gold, platinum, palladium, and alloys thereof.
8 . The electronic assembly in accordance with claim 1 , wherein the heat-sink-element contains an appendage defining a shoulder and a stop, wherein the shoulder is configured to insert the shank into the via and the stop is configured to seat the shank against the first-surface.