IP Library Granted Patent US 10,519,552
Granted Patent B2
US 10,519,552 · App. 15/388,223 · Granted Dec 31, 2019

Deposited material structure with integrated component

Inventors: Gary D. Roberge (Tolland, CT); William J. Brindley (Hebron, CT)
Assignee: UNITED TECHNOLOGIES CORPORATION
C23C24/04B22F3/24B22F5/009B22F5/04B22F7/08B33Y80/00F01D25/005B22F3/02B22F2003/244B22F2003/247B22F2005/005B22F2998/10F05D2230/31
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Quick Facts
Patent No.
US 10,519,552
App. No.
15/388,223
Granted
Dec 31, 2019
Kind
B2
Abstract

A method for forming a metallic structure having a secondary component includes positioning the secondary component on a main formation surface of a main tool, the main formation surface corresponding to a desired shape of a first layer of material. The method also includes depositing a layer of material on the secondary component and the main formation surface using a cold-spray technique such that the layer of material bonds to the secondary component. The method also includes removing the layer of material and the secondary component to form the metallic structure.

Claims (9)

1. A method for forming a metallic structure having a secondary component, comprising:

positioning the secondary component in a volume defined by a main formation surface of a main tool, the main formation surface corresponding to a desired shape of a first layer of material, and the volume having a shape that corresponds to the secondary component;

positioning a secondary tool on the secondary component;

depositing a layer of material on the secondary component, the secondary tool and the main formation surface by cold spraying the layer of material such that the layer of material bonds to the secondary component and is at least partially deposited on the secondary tool;

removing the layer of material and the secondary component from the main tool to form the metallic structure; and

removing the secondary tool to form a space between at least a portion of the secondary component and the layer of material.

2. The method of claim 1 , wherein the secondary component has a bonding surface configured to receive the layer of material, the bonding surface being textured to enhance bonding with the layer of material.

3. The method of claim 1 , wherein removing the secondary tool includes forming a hole in the layer of material and leaching the secondary tool from the layer of material through the hole via at least one of etching the secondary tool or melting the secondary tool.

4. The method of claim 3 , further comprising sealing the hole after removing the secondary tool.

Assignments (5)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED AT REEL: 040746 FRAME: 0842. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 27, 2016
From: ROBERGE, GARY D.; BRINDLEY, WILLIAM J.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 041190/0186 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2016
From: ROBERGE, GARY D.; BRINDLEY, WILLIAM J.
To: GOODRICH CORPORATION
Reel/Frame 040746/0842 →
Continuity (1)
Related Publication 20180179638A1 · Jun 28, 2018