IP Library Granted Patent US 10,312,003
Granted Patent B2
US 10,312,003 · App. 15/388,322 · Granted Jun 4, 2019

Circuit board with thermal paths for thermistor

Inventors: BongGeun Chung (Incheon, KR); YoonJoo You (Jeonju, KR)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01C7/04H05K1/0201H01R12/58H05K1/181H05K1/182H05K3/3447H05K2201/10022H05K2201/10196
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Quick Facts
Patent No.
US 10,312,003
App. No.
15/388,322
Granted
Jun 4, 2019
Kind
B2
Abstract

A circuit board for an electronic device includes pattern areas on both sides of the circuit board. Each end of a thermistor is electrically connected to electrically conductive pads on pattern areas on the top and bottom sides of the circuit board. An input plug is electrically connected to an end of the thermistor. The input plug is electrically connected to the thermistor by way of an input connector to which the circuit board is inserted.

Claims (37)

1. A circuit board comprising:

a first conductive pad on a top side of the circuit board;

a second conductive pad on a bottom side of the circuit board;

a thermistor mounted on the circuit board, the thermistor comprising a first end that is electrically connected to the first and second conductive pads and a second end that is electrically connected to a component that is mounted on the circuit board,

an input plug:

an input connector electrically coupled to the input plug, and the input connector comprising a first contact and a second contract; and

the first contact coupled directly to the first conductive pad on the top side of the circuit board, and the second contact coupled directly to the second conductive pad on the bottom side of the circuit board.

2. The circuit board of claim 1 , wherein the first and second conductive pads are solder pads and the thermistor is soldered onto the first and second conductive pads.

3. The circuit board of claim 1 , wherein the thermistor is a negative temperature coefficient (NTC) thermistor.

4. The circuit board of claim 1 , wherein the component that is electrically connected to the second end of the thermistor comprises a rectifier.

5. The circuit board of claim 1 , further comprising a third conductive pad on the top side of the circuit board and a fourth conductive pad on the bottom side of the circuit board.

6. The circuit board of claim 5 , wherein the second end of the thermistor is electrically connected to the third and fourth conductive pads.

7. The circuit board of claim 6 , wherein the first, the second, the third, and the fourth conductive pads comprise solder pads, the first end of the thermistor is soldered to the first and second conductive pads, and the second end of the thermistor is soldered to the third and fourth conductive pads.

8. The circuit board of claim 1 , wherein the thermistor is mounted on the top side of the circuit board.

9. The circuit board of claim 1 further comprising the input plug configured to act as a heat sink for the thermistor.

10. The circuit board of claim 9 wherein the input plug has a volume 0.22 cm 3 .

11. An electronic device comprising:

a printed circuit board comprising a top side and a bottom side, a first solder pad on the top side, a second solder pad on the bottom side, and a thermistor having a first end that is soldered to the first and second solder pads;

an enclosure that houses the printed circuit board;

an input plug that extends outward away from the enclosure;

an input connector disposed within the enclosure and electrically coupled to the input plug, and the input connector comprising a first contact and a second contact;

the first contacted coupled directly to the first solder pad on the top side of the printed circuit board, and the second contact coupled directly to the second solder pad on the bottom side of the circuit board.

12. The electronic device of claim 11 , wherein the input plug extends out of the enclosure.

13. The electronic device of claim 11 , wherein the thermistor comprises a negative temperature coefficient (NTC) thermistor.

14. The electronic device of claim 11 , wherein the thermistor is mounted on the top side of the printed circuit board.

15. The electronic device of claim 11 , wherein the printed circuit board further comprises a third conductive pad on the top side and a fourth conductive pad on the bottom side, and a second end of the thermistor is soldered to the third and fourth conductive pads.

16. The electronic device of claim 11 further comprising the input plug configured to act as a heat sink for the thermistor.

17. A circuit board comprising:

a first pattern area on a top side of the circuit board;

a second pattern area on a bottom side of the circuit board;

a thermistor comprising a first end that is electrically connected to an electrically conductive portion on the first pattern area and to an electrically conductive portion on the second pattern area, the thermistor further comprising a second end that is electrically connected to an electrically conductive portion on a third pattern area;

an input plug;

an input connector electrically coupled to the input plug, and the input connector comprising a first electrical contact and a second electrical contact; and

the first electrical contact coupled directly to the first pattern area on the top side of the circuit board, and the second electrical contact coupled directly to the second pattern area on the bottom side of the circuit board.

18. The circuit board of claim 17 , wherein the first end of the thermistor is soldered to the electrically conductive portions on the first and second pattern areas.

19. The circuit board of claim 18 , wherein the second end of the thermistor is soldered to the electrically conductive portion on the third pattern area on the top side of the circuit board and to an electrically conductive portion on a fourth pattern area on the bottom side of the circuit board.

20. The circuit board of claim 17 further comprising the input plug configured to act as a heat sink for the thermistor.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →
PATENT SECURITY AGREEMENT Recorded Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2017
From: CHUNG, BONGGEUN; YOU, YOONJOO
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 040875/0458 →
Continuity (2)
Provisional Application 62280303 · Jan 19, 2016
Related Publication 20170207008A1 · Jul 20, 2017