Light emitting diode (LED) module for LED luminaire
View Patent ↗A light emitting diode (LED) module for a light fixture includes a substrate with an upper surface and a lower surface. Various pressure multiplying pads are integrally connected to the lower surface, and each pressure multiplying pad extends away from the lower surface. LEDs are attached to the upper surface, along with a set of conductive lines so that each conductive line electrically connects a corresponding LED to a power inputs. Each of the pressure multiplying pads may be positioned opposite a corresponding LED. A flexible lens cover may cover the upper surface and the LEDs, while leaving the lower surface and pressure multiplying pads exposed so that the pads can contact a heat sink of the light fixture.
1. A light emitting diode (LED) module for an LED light fixture comprising:
a substrate that comprises:
an upper surface,
a lower surface,
at least one power input, and
a plurality of pressure multiplying pads, each of which is integrally connected to a portion of the lower surface and extending away from the lower surface, and wherein the pressure multiplying pads are arranged so that a portion of the lower surface does not have any of the pressure multiplying pads connected to it;
a plurality of LEDs positioned over the upper surface; and
a plurality of conductive lines positioned so that each conductive line electrically connects a corresponding LED to at least one of the power inputs.
2. The LED module of claim 1 , wherein the LED module is coated with a parylene material.
3. The LED module of claim 1 , wherein each of the pressure multiplying pads is positioned under a corresponding LED.
4. The LED module of claim 3 , wherein each of the pressure multiplying pads extends beyond a lower surface of any sidewall of the substrate.
5. The LED module of claim 1 , wherein:
the LED module is included within a light fixture comprising a heat sink body; and
the LED module is positioned within an opening of the heat sink body.
6. The LED module of claim 5 , wherein the LED module is at least partially coated with a parylene material so that the parylene material is a part of the pressure multiplying pads and provides a thermal transfer function between the pressure multiplying pads and the heat sink body.
7. The LED module of claim 1 , further comprising:
a ridge positioned around a perimeter of the substrate; and
a flexible lens cover shaped to fit over the upper surface and around the ridge while leaving at least a portion of the lower surface exposed.
8. The LED module of claim 1 , further comprising a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the upper surface so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate.
9. The LED module of claim 8 , wherein the layer is selectively positioned under the LEDs and the conductive lines so that the layer does not fully cover the substrate.
10. The LED module of claim 1 , wherein the pressure multiplying pads are formed together as a single structure.
11. The LED module of claim 1 , wherein each of the pressure multiplying pads extends inward from a position proximate an outer edge of the substrate.
12. A light emitting diode (LED) module for an LED light fixture comprising:
a substrate that comprises:
an upper surface,
a lower surface,
a plurality of pressure multiplying pads, each of which is integrally connected to a portion of the lower surface and extending away from the lower surface, and wherein the pressure multiplying pads are arranged so that a portion of the lower surface does not have any of the pressure multiplying pads connected to it;
a plurality of LEDs positioned over the upper surface;
a plurality of conductive lines positioned so that each conductive line electrically connects a corresponding LED to a power input; and
a flexible lens cover shaped to fit over the upper surface while leaving at least a portion of the lower surface exposed.
13. The LED module of claim 12 , wherein the substrate is at least partially coated with a parylene material.
14. The LED module of claim 12 , wherein each of the pressure multiplying pads is positioned under a corresponding LED.
15. The LED module of claim 14 , wherein each of the pressure multiplying pads extends beyond a lower surface of any sidewall of the substrate.
16. The LED module of claim 12 , wherein:
the LED module is included within a light fixture comprising a heat sink body; and
the LED module is positioned within an opening of the heat sink body.
17. The LED module of claim 16 , wherein the LED module is at least partially coated with a parylene material so that the parylene material is a part of the pressure multiplying pads and provides a thermal transfer function between the pressure multiplying pads and the heat sink body.
18. The LED module of claim 12 , further comprising:
a ridge positioned around a perimeter of the substrate; and
the flexible lens cover is shaped to fit over the upper surface and around the ridge.
19. The LED module of claim 12 , further comprising a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the upper surface so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate.
20. The LED module of claim 19 , wherein the layer is selectively positioned under the LEDs and the conductive lines so that the layer does not fully cover the substrate.
21. The LED module of claim 12 , wherein the pressure multiplying pads are formed together as a single structure.
22. The LED module of claim 12 , wherein each of the pressure multiplying pads extends inward from a position proximate an outer edge of the substrate.