Optical lens structures for light emitting diode (LED) array
A light fixture includes one or more of light emitting diode (LED) modules. Each of the LED modules may include a substrate holding a plurality of LEDs, and a printed circuit board connected to the plurality of LEDs. Each of the LED modules may also include a flexible lens cover including a plurality of lenses, each positioned to be located over one of the LEDs. The flexible lens cover may include a side sealing structure configured to interface with the substrate and seal the lens cover to the substrate.
1. A light emitting diode (LED) module for an illumination device, the LED module comprising: a substrate holding a plurality of LEDs; a circuit board connected to the LEDs; and a flexible lens cover comprising a plurality of lenses, each positioned to be located over one of the LEDs; wherein the flexible lens cover comprises a side sealing structure configured to interface with the substrate and seal the lens cover to the substrate; wherein the substrate comprises a ridge along each outer edge of the substrate, so that the ridge has a thickness that is less than a thickness of a portion of the substrate that holds the LEDs and the circuit board; and the flexible lens cover comprises a lip configured to fit over the ridge.
2. The LED module of claim 1 , wherein the ridge comprises a groove positioned in a central area of the ridge, so that when pressure is applied to the flexible lens cover, the lens cover will at least partially fill the groove to form a seal.
3. The LED module of claim 1 , wherein the side sealing structure comprises an indentation on the lens cover configured to mechanically interface with a counterpart on an edge of the circuit board.
4. The LED module of claim 1 , wherein the circuit board comprises a female snap-fit indentation that is mechanically interfaced with a male snap-fit counterpart on a lower end of the side sealing structure.
5. The light fixture of claim 1 , wherein the flexible lens structure comprises a plurality of lenses that are co-molded with the side sealing structure.
6. The LED module of claim 1 , wherein the side sealing structure comprises one or more nub structures that provide a watertight seal of the lens cover to the substrate.
7. The LED module of claim 1 , further comprising a plurality of conductive lines positioned over the substrate to provide a conductive path between each of the LEDs and a power source.
8. The LED module of claim 7 , further comprising a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and substrate so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate.
9. An illumination device, comprising: a body portion that provides a heat sink; a power supply unit; and an opening that receives a plurality of LED modules in the body portion, wherein each of the LED modules comprises: a substrate holding a plurality of LEDs, a circuit board connected to the LEDs, and a flexible lens cover comprising a plurality of lenses, each positioned to be located over one of the LEDs; wherein the flexible lens cover of each LED module comprises a side sealing structure configured to interface with the substrate of the LED module and seal the lens cover to the substrate of the LED module; wherein, for each of the LED modules: the substrate comprises a ridge along each outer edge of the substrate, so that the ridge has a thickness that is less than a thickness of a portion of the substrate that holds the LEDs and the circuit board; and the flexible lens cover comprises a lip configured to fit over the ridge.
10. The illumination device of claim 9 , wherein, for each of the LED modules:
the ridge comprises a groove positioned in a central area of the ridge, so that when pressure is applied to the flexible lens cover, the lens cover will at least partially fill the ridge to form a seal.
11. The illumination device of claim 9 , wherein, for each of the LED modules, the side sealing structure comprises an indentation on the lens cover configured to mechanically interface with a counterpart on an edge of the circuit board.
12. The illumination device of claim 9 , wherein, for each of the LED modules, the circuit board comprises a female snap-fit indentation mechanically interfaced with a male snap-fit counterpart on a lower end of the side sealing structure.
13. The illumination device of claim 9 , wherein, for each of the LED modules, the flexible lens structure comprises a plurality of lenses that are co-molded with the side sealing structure.
14. The illumination device of claim 9 , wherein, for each of the LED modules, the side sealing structure comprises one or more nub structures that provide a watertight seal of the lens cover to the substrate.
15. The illumination device of claim 9 , wherein each of the LED modules further comprises a plurality of conductive lines positioned over the substrate to provide a conductive path for connecting each of the LEDs to the power supply unit.
16. The illumination device of claim 15 , wherein each of the LED modules further comprises a layer of electrically non-conductive, thermally conductive material positioned between the conductive lines and the substrate so that, in operation, the LEDs and conductive lines are electrically separated from the substrate while heat from the LEDs passes through the layer to the substrate.